2019
DOI: 10.1109/access.2019.2931658
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Intra- and Inter-Chip Transmission of Millimeter-Wave Interconnects in NoC-Based Multi-Chip Systems

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Cited by 21 publications
(11 citation statements)
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“…Packagewise, open chip or custom packages have been evaluated most frequently [54], [68], [76] for the same reason and despite of the pioneering remarks on flip-chip package compatibility made in early stages of this research area [51]. However, there has been a recent surge of works considering schemes compatible with flip-chip packages [63], [79], [83], which have been mostly based on full-wave simulation due to the cost of instrumenting flip-chip packages. Finally, bond-wire antennas/packages [59] have been less relevant given the widespread use of the flip-chip.…”
Section: Channel Modeling Methodsmentioning
confidence: 99%
“…Packagewise, open chip or custom packages have been evaluated most frequently [54], [68], [76] for the same reason and despite of the pioneering remarks on flip-chip package compatibility made in early stages of this research area [51]. However, there has been a recent surge of works considering schemes compatible with flip-chip packages [63], [79], [83], which have been mostly based on full-wave simulation due to the cost of instrumenting flip-chip packages. Finally, bond-wire antennas/packages [59] have been less relevant given the widespread use of the flip-chip.…”
Section: Channel Modeling Methodsmentioning
confidence: 99%
“…Down to the chip level, most characterization efforts have thus far been limited to mmWave frequencies [229]. Analytical models [231], simulation-based studies [232], and actual measurement campaigns [223], [224] have been conducted under different assumptions. In most cases, path loss is modeled by an empirical log-scale approximation resulting in a derived the path loss exponent, rather than using a bottom up approach with Equation (1).…”
Section: On-chip Communication Channelsmentioning
confidence: 99%
“…The return loss was calculated by using the S (1,1) port of reflection coefficient & it was found to be -14 dB. In reference [15] the communication capabilities of short range millimeter wave in networkon-chip based on multi-core processors is investigated along with transmission capabilities between on-chip antennas for both inter and intra chip communication in multi-chip computing systems. The abilities of the wireless hubs existing in WiNoC to institute a postsilicon validation model for communication networks is discussed in [16].…”
Section: Related Workmentioning
confidence: 99%