Interfacial reactions at Ga-21.5In–10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions

Interfacial Intermetallic Compounds Growth Kinetics and Mechanical Characteristics of Ga-Cu Interconnects Prepared Via Transient Liquid Phase Bonding

“…Furthermore, this research has proposed another hypothesis for the formation of voids in Cu/Ga/Cu joints, based on the observed strong anisotropy of θ crystal as previously reported by Gao et al [33]. The microstructural evolution of Cu/Ga/Cu joints during TLPB at 150ºC, along with the schematic diagrams illustrating the growth of IMCs grains, are depicted in Fig.…”