Interfacial microstructure evolution and shear behavior of Au–12Ge/Ni solder joints during isothermal aging

Ma, Yunzhu; Wu, Tong; Liu, Wensheng; Huang, Yufeng; Tang, Shibo; Wang, Yikai

doi:10.1007/s10854-016-5974-3

Cited by 9 publications

(4 citation statements)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Therefore, by reference to a number of binary diagrams and the research results of [18][19][20][21][22], a new Au-Ge solder was developed by addition of 1.5 wt % Ni and 0.5 wt % Cu into Au-10 wt % Ge. The role of Ni and Cu is mainly to promote the strength of the solder and its wettability to the Cu-Cr-Zr alloy.…”

Section: Properties Of the Au Based Soldermentioning

confidence: 99%

Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

et al. 2017

Metals

View full text Add to dashboard Cite

Au-Ge-Ni solder was chosen for brazing of the Cu-Cr-Zr alloy cylinder and a part with a cylindrical hole (sleeve) below 550 • C. The Au based solder was first sintered on the surface of the cylinder and then brazed to the inner surface of the sleeve. The effects of the heating process, the temperature and the holding time at the temperature on the microstructure of the sintered layer on the surface of the cylinder, the brazed interfacial microstructure, and the brazed shear strength between the cylinder and the sleeve were investigated by scanning electron microscope, energy dispersive X-ray spectroscopy analysis, and tensile shear tests. By approach of side solder melt feeding and brazing under proper parameters, the voids and micro cracks due to a lack of enough solder melt feeding are greatly lessened and the brazed shear strength of 100 MPa is ensured even with large clearances around 0.01 mm.

show abstract

Section: Properties Of the Au Based Soldermentioning

confidence: 99%

Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

et al. 2017

Metals

View full text Add to dashboard Cite

show abstract

“…Thereinto, both the Au and Cu layer were the coatings on Cu substrates. Overall, the microstructure and shear strength of Au-12Ge solder joints subjected to extreme thermal shock were investigated, and the fracture morphologies of solder joints at different cycles of shock were analyzed in this study [21,22].…”

Section: Introductionmentioning

confidence: 99%

Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint

Wang

Xue

Long

et al. 2020

Metals

View full text Add to dashboard Cite

Extreme temperature change has generally been the great challenge to spacecraft electronic components, particularly in long, periodic, deep-space exploration missions. Hence, researchers have paid more attention to the reliability of component packaging materials. In this study, the microstructure evolution on the interface of Cu/Ni/Au/Au-12Ge/Au/Ni/Cu joints, as well as the effects of extreme thermal shock on mechanical properties and the fracture mode in the course of extreme thermal changes between −196 and 150 °C, have been investigated. Results revealed that the interface layers comprised of two thin layers of NiGe and Ni5Ge3 compounds after Au-12Ge solder alloy was soldered on the Au/Ni/Cu substrate. After extreme thermal shock tests, the microstructure morphology converted from scallop type to planar one due to the translation from NiGe to Ni5Ge3. Meanwhile, the thickness of interface layer hardly changed. The shear strength of the joints after 300 cycles of extreme thermal shock was 35.1 MPa, which decreased by 19.61%. The fracture location changed from the solder to solder/NiGe interface, and then to the interface of NiGe/Ni5Ge3 IMC layer. Moreover, the fracture type of the joints gradually transformed from ductile fracture mode to brittle mode during thermal shock test. Simultaneously, the formation and extension of defects, such as micro-voids and micro-cracks, were found during the process of thermal shock due to the different thermal expansion coefficient among the solder, interface layer and substrate.

show abstract

“…As a typical eutectic alloy, Au-12 wt.%Ge alloy has many advantages of low vapor pressure, low contact resistance, low melting temperature, high electrical conductivity and thermal conductivity, etc. It is often applied as a low-melting solder and widely used in chip welding, electronic packaging and other fields [4][5][6][7]. At present, the research on Au-12 wt.%Ge alloy at home and abroad mainly focuses on the application process and properties, while the solidification behaviors of Au-12 wt.%Ge alloy are rarely studied.…”

Section: Introductionmentioning

confidence: 99%

Correlation between Solidified Microstructure Evolution and Undercooling of Au-12 Wt.%Ge Eutectic Alloy

Zhu

Xiong

et al. 2020

MSF

View full text Add to dashboard Cite

Highly undercooled solidification experiments were carried out by melt purification combined with cyclic superheating method on Au-12 wt.%Ge eutectic alloy. The solidification structures of Au-12 wt.%Ge eutectic alloy under different undercoolings were also analyzed by using the scanning electron microscope (SEM). The experimental results revealed that the maximum undercooling could reach up to 102 K. The microstructure analysis showed that the coarse bulk eutectic existed in the solidification structure when the undercooling was less than 34 K. When the undercooling was larger than 34 K and less than 56 K, the solidification structure transformed into cellular eutectic. The coarse primary (α-Au) phase precipitated from the undercooled alloy melt when the undercooling was larger than 56 K. The volume fraction of the primary (α-Au) phase gradually increased with the increase of undercooling. In this paper, a method to regulate the solidification structure of Au-12 wt.%Ge eutectic alloy is proposed, which provides a new way to improve the solidification structure and has important guiding significance for the processing and forming process of Au-12 wt.%Ge eutectic alloy.

show abstract

Interfacial microstructure evolution and shear behavior of Au–12Ge/Ni solder joints during isothermal aging

Cited by 9 publications

References 22 publications

Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint

Correlation between Solidified Microstructure Evolution and Undercooling of Au-12 Wt.%Ge Eutectic Alloy

Contact Info

Product

Resources

About