Abstract:Extreme temperature change has generally been the great challenge to spacecraft electronic components, particularly in long, periodic, deep-space exploration missions. Hence, researchers have paid more attention to the reliability of component packaging materials. In this study, the microstructure evolution on the interface of Cu/Ni/Au/Au-12Ge/Au/Ni/Cu joints, as well as the effects of extreme thermal shock on mechanical properties and the fracture mode in the course of extreme thermal changes between −196 and… Show more
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