Interconnection Costs of Various Substrates-The Myth of Cheap Wire

Knausenberger, Wulf; Schaper, L.W.

doi:10.1109/tchmt.1984.1136353

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“…spaces are standard. As a result, a higher packing density is possible on the substrate,4 which eventually means fewer PWBs, backplanes, and cabinets are needed for a given function. Techniques for fabricating components on ceramic hybrids are divided into two groups:…”

mentioning

confidence: 99%

Interconnection Media

Giffels

Gashler

Morabito

et al. 1987

At&T Technical Journal

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mentioning

confidence: 99%

Interconnection Media

Giffels

Gashler

Morabito

et al. 1987

At&T Technical Journal

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Interconnection Systems

Knausenberger¹

2013

Materials Science and Technology

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The sections in this article are Perspective Interconnection Technology Trends and Drivers Trends Interconnection Density as a Cost Driver Interconnection Capability and Cost Metric Interconnection Cost Comparisons Matching Capability and Need Interconnection Hierarchy Partitioning Introduction Partitioning Approaches Component‐Oriented Partitioning Interconnection‐Oriented Partitioning Interconnection Distribution Patterns Broadcast Interconnections Network Interconnections Status/Control Interconnections Ideal System Partitioning Approach Multichip Modules Printed Wiring Board ( PWB ) Technology Introduction Material Systems PWB Categories Rigid PWBs Discrete Wired Circuits Flexible PWBs PWB Production Processes Basic Processes Fabrication Sequences for Different PWB Types Future Directions Merging of Markets New Form of Consumer Services Evolution of Technology

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Interconnection Systems

Knausenberger

2000

Handbook of Semiconductor Technology Set

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Interconnection Costs of Various Substrates-The Myth of Cheap Wire

Cited by 20 publications

References 1 publication

Interconnection Media

Interconnection Media

Interconnection Systems

Interconnection Systems

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