Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH840
DOI: 10.1109/isapm.1999.757296
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Intelligent control of via formation process in MCM-L/D substrates using neural networks

Abstract: Via formation is a critical process sequence in multichip module (MCM) manufacturing, as it greatly impacts yield, density, and reliability. To achieve low-cost manufacturing, modeling, optimization, and control of via formation are therefore crucial. In this paper, a model-based supervisory control algorithm is developed and applied to reduce undesirable behavior resulting from various process disturbances. Sequential neural network process models are used for system identification, and genetic algorithms are… Show more

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Cited by 6 publications
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References 12 publications
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