Optimization of variable frequency microwave curing using neural networks and genetic algorithms

Davis, C.; Tanikella, R.; Sung, Taehyan; Kohl, Paul A.; May, G.S.

doi:10.1109/ectc.2003.1216534

Cited by 4 publications

(1 citation statement)

References 11 publications

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“…However, current limitations in VFM processing include uncertain process characterization methods, lack of reliable temperature measuring techniques, and the lack of control over the various processes occurring in the VFM chamber. To address these issues, prior work has utilized experiment design, neural networks, and genetic algorithms to model and optimize the polymers cured on silicon using a VFM furnace [7], [8]. The current research addresses the challenge of a reliable temperature measuring device by the development of an acoustic temperature sensor for VFM processing monitoring.…”

Section: Introductionmentioning

confidence: 99%

In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing

Davis

Dickherber²,

Hunt³

et al. 2008

IEEE Trans. Electron. Packag. Manufact.

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Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing can be a viable alternative to conventional thermal techniques. However, current limitations include a lack of reliable temperature measuring techniques. This research focuses on developing a reliable temperature measuring system using acoustic techniques to monitor low-k polymer dielectrics cured on silicon wafers in a VFM furnace. The acoustic sensor exhibits the capability to measure temperatures from 20 C to 300 C with an attainable accuracy of 2 degrees.

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Section: Introductionmentioning

confidence: 99%