Integration of Thick-Film Permanent Magnets for MEMS Applications

Abstract

This paper presents a method of integrating thick permanent magnetic films into a microfabrication process. An enhanced binding method consisting of a hybrid of Parylene N and Parylene C thin films was used in conjunction with various types of NdFeB powders to create embedded permanent magnet films. A systematic study of composite magnetic powders was developed using three different powders in order to control intrinsic coercivities (H ci ) and remanence (B r ) properties. In addition, four types of dispensing methods were investigated. A liquid dispensing method demonstrated the highest fill factor (79%) for a 400-µm-thick film with an enhanced remanence value of 0.59 T. A range of remanence values from 0.2 to 0.59 T were developed by varying the concentration of multiple magnetic powders within the composite material. Validation of the integrated magnetic material into a microelectromechanical system device was demonstrated through a polymer on a silicon cantilever structure.[ 2016-0073]Index Terms-Microelectromechanical systems (MEMS), integration, magnetic powders, bonded permanent magnets, Parylene.

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