2000
DOI: 10.1080/10584580008215660
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Integration of H2 barriers for ferroelectric memories based on SrBi2Ta2O9 (SBT)

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Cited by 11 publications
(6 citation statements)
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“…This, however, is known to be decremental to perovskite and layered perovskite ferroelectrics. [ 12 ]…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…This, however, is known to be decremental to perovskite and layered perovskite ferroelectrics. [ 12 ]…”
Section: Introductionmentioning
confidence: 99%
“…to be decremental to perovskite and layered perovskite ferroelectrics. [12] To retrace chemical modifications that are directly related to these different RTA crystallization processes, we present an investigation of the local chemistry of top electrode in IrO 2 /HZO/IrO 2 MIM structures. We investigate the chemical state of the top IrO 2 electrode dependent on the RTA atmosphere, i.e., anneals in NA, OA, and FGA atmosphere, as schematically shown in Figure 1.…”
Section: Introductionmentioning
confidence: 99%
“…Due to the large number of defects, leakage current, and large lattice mismatch between perovskite ferroelectrics and silicon, it is always necessary to use a buffer layer with a proper interface Table 1 The ferroelectric properties of PZT [29][30][31][32], SBT [33][34][35][36][37][38][39], and Si:HfO 2 [28]. with the substrate.…”
Section: Buffer Layermentioning
confidence: 99%
“…The properties of two wellknown perovskite ferroelectrics, Lead Zirconate Titanate (PZT) and Strontium Barium Titanate (SBT), is compared with Si:HfO 2 in Table 1. The recently discovered ferroelectric thin film, Si:HfO 2 [28,6], has a relatively high coercive field that ensures a large memory window [29][30][31][32][33][34][35][36][37][38][39].…”
Section: Ferroelectric Materialsmentioning
confidence: 99%
“…Hydrogen barrier and BEOL.-It is well known that exposure to hydrogen at elevated temperatures can cause severe damage to a ferroelectric capacitor. 49 Hydrogen is present in many BEOL processes like oxide, nitride, or tungsten deposition. Additionally a hydrogen-containing forming gas anneal is usually required to anneal interface traps at the Si/SiO 2 interface of MOS transistors.…”
Section: Ferroelectric Memory Integrationmentioning
confidence: 99%