Integrated microwave field simulation using three dimensional finite elements

Cendes, Z.J.; Lee, J.F.; Shenton, D.; Shyamkumar, B.; Smetak, E.C.; Sun, Din-Kow

doi:10.1109/mwsym.1990.99679

Cited by 6 publications

(4 citation statements)

References 3 publications

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“…Experimental verification of both the connector discontinuities and cross talk is important because vendor-supplied data are generally insufficient and not supplied for relevant signal rise times. Three-dimensional modeling of the equivalent , , and connector matrices also are not usually performed by the suppliers, and it is up to the user to generate these using such tools as described in [38]. Measurements can be performed on fairly simple, specially built test structures to extract just the performance parameter of interest.…”

Section: A High-performance High-density Cablesmentioning

confidence: 99%

“…There are no standard specifications for any of the commercially available connectors. Some vendors provide an equivalent , , and matrix for their connectors based on finite-element, three-dimensional modeling algorithms [38]. Others use two-dimensional modeling of the connector subsections and concatenate them to represent all the bends and dielectric interfaces with much loss of accuracy due to improper accounting of the three-dimensional interactions.…”

Section: B Printed-circuit-board Wiringmentioning

confidence: 99%

“…This factor was then used to multiply the results of another electrostatic-based program [20] that accommodates arbitrary-shaped conductors but not anisotropic dielectrics. In method B, a finite-element algorithm [38] was used directly. It was concluded then that BPDA-PDA exhibits an in-plane dielectric constant of -, which is significantly higher than the out-of-plane value of .…”

Section: Thin-film Wiringmentioning

confidence: 99%

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Electrical characteristics of interconnections for high-performance systems

Deutsch

1998

Proc. IEEE

150

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A review is presented of the electrical characteristics of highdensity, high-performance interconnections used in digital and communication applications. These interconnections behave as lossy transmission lines for the frequency range of interest. A brief theoretical explanation of the key properties of lossy, coupled transmission lines is given. A new short-pulse propagation technique used for characterizing a large category of wiring is described. A detailed description is made of each of the major interconnect types encountered, namely, shielded cables, printed circuit boards, ceramic carriers, thin-film wiring, and on-chip wiring. Representative examples are given in each case to highlight the key performance-limiting parameters. The modeling and measurement techniques used are explained and examples are given. Future technological directions and their effect on performance are discussed.

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Section: A High-performance High-density Cablesmentioning

confidence: 99%

Section: B Printed-circuit-board Wiringmentioning

confidence: 99%

Section: Thin-film Wiringmentioning

confidence: 99%

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Electrical characteristics of interconnections for high-performance systems

Deutsch

1998

Proc. IEEE

150

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“…15 shows the measured and simulated waveforms for the pinned connector case tested with a 289-ps rise-time source. The vendorsupplied models for the connector were calculated using a three-dimensional (3-D) finite-element algorithm [9]. The agreement between waveforms is considered quite good.…”

Section: Rise-time Distortionmentioning

confidence: 99%

Electrical characteristics of high-performance pin-in-socket and pad-on-pad connectors

Deutsch

Surovic

Campbell

et al. 1997

IEEE Trans. Comp., Packag., Manufact. Technol. B

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Two types of high-performance, high-density connectors, pin-in-socket, and pad-on-p ad, are investigated for providing many hundreds of signal contacts in large-panel, cardto-board applications. The two examples were selected as topof-the-line contenders for mechanically robust interconnections that can be used for transmitting 500 Mb/s and even 1 Gb/s data-rate signals, and with comparable cost. While the pinned connector offers a proven technology, the newly introduced padon-pad connector can provide at least 1.5 times higher number of signal contacts and lower crosstalk. Experimental characterization of signal integrity, connector delay, impedance discontinuity, crosstalk, and maximum current capability, is performed for both connectors in order to compare their relative performance.Index Terms-Pad-on-pad (surface-mount) connectors, pin-insocket (pinned).

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Broadband Characterization of Representative Circuit-To-Circuit Interconnections

Deutsch

1997

Directions for the Next Generation of MMIC Devices and Systems

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Integrated microwave field simulation using three dimensional finite elements

Cited by 6 publications

References 3 publications

Electrical characteristics of interconnections for high-performance systems

Electrical characteristics of interconnections for high-performance systems

Electrical characteristics of high-performance pin-in-socket and pad-on-pad connectors

Broadband Characterization of Representative Circuit-To-Circuit Interconnections

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