Electrical characteristics of high-performance pin-in-socket and pad-on-pad connectors

Abstract

Two types of high-performance, high-density connectors, pin-in-socket, and pad-on-p ad, are investigated for providing many hundreds of signal contacts in large-panel, cardto-board applications. The two examples were selected as topof-the-line contenders for mechanically robust interconnections that can be used for transmitting 500 Mb/s and even 1 Gb/s data-rate signals, and with comparable cost. While the pinned connector offers a proven technology, the newly introduced padon-pad connector can provide at least 1.5 times higher number of signal contacts and lower crosstalk. Experimental characterization of signal integrity, connector delay, impedance discontinuity, crosstalk, and maximum current capability, is performed for both connectors in order to compare their relative performance.Index Terms-Pad-on-pad (surface-mount) connectors, pin-insocket (pinned).

Signal Transmission Analysis of Burn-In Socket for Fine-Pitch Ball Grid Array Package

“…Also, their insertion and reflection losses are investigated. It is known that impedance matching between the interconnected devices is critical in determining the signal transmission characteristics [7][8][9]. Generally, the characteristic impedance (Z 0 ) of electronic devices and components is designed to be 50  to allow for more consistent signal transmission.…”

Electrical characteristics of interconnections for high-performance systems

“…The two connectors are a five-row, pinin-socket design, having a 2-mm-pin grid and a six-row, pad-on-pad connector with a 1.27-mm-contact grid, shown in Figs. 18 and 19, respectively [41]. There are no standard specifications for any of the commercially available connectors.…”

“…In the actual connector array, the signal and ground pads can be widely separated, especially for the 5 : 1 case. The only place the card wiring is producing additional noise is in the fan-out lines in the pad or pin array [41]. Due to equipment limitations, contact pairs (one active, one quiet) are tested (pair-wise measurement) and the results from all the active pins surrounding the quiet pin are linearly superimposed.…”

Multisegment Multiconductor Transmission Line Model of High-Current Card-Edge Connectors With Analytically Calculated Model Parameters

“…Connectors are typically modeled by multisegment lumpedelements as in [1], [3]- [7] or multisegment transmission lines as in [8]- [10]. In all of these papers, the model parameters are fitted to the measured data, either the S-parameter measurements as in [3], the time-domain reflectometry (TDR) as in [4], [6]- [9], or both as in [1] and [5]. Alternatively, electromagnetic (EM) simulations can be used to generate the required data [10], [11].…”