2014
DOI: 10.1007/s10854-014-1784-7
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Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates

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Cited by 2 publications
(1 citation statement)
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“…Copper plated-through-holes (PTHs), however, under DC voltage bias in the presence of humidity and temperature pose reliability concerns [1][2][3][4]. Catastrophic failures (i.e., electrical insulation failures) due to electrochemical migration between PTHs in FR4s in the presence of humidity and DC bias have been reported by several researchers [5][6][7][8][9][10]. Epoxy-based boards absorb moisture in humid conditions resulting in the diffusion of moisture into the glass-fiber reinforced boards, which has several detrimental effects such as polymer swelling, hygroscopic stresses, hydrolysis of resin-glass fiber interfacial bonds and loss of insulation resistance.…”
Section: Introductionmentioning
confidence: 99%
“…Copper plated-through-holes (PTHs), however, under DC voltage bias in the presence of humidity and temperature pose reliability concerns [1][2][3][4]. Catastrophic failures (i.e., electrical insulation failures) due to electrochemical migration between PTHs in FR4s in the presence of humidity and DC bias have been reported by several researchers [5][6][7][8][9][10]. Epoxy-based boards absorb moisture in humid conditions resulting in the diffusion of moisture into the glass-fiber reinforced boards, which has several detrimental effects such as polymer swelling, hygroscopic stresses, hydrolysis of resin-glass fiber interfacial bonds and loss of insulation resistance.…”
Section: Introductionmentioning
confidence: 99%