2007 8th International Conference on Electronic Packaging Technology 2007
DOI: 10.1109/icept.2007.4441501
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Insulation Degradation and Bias Acceleration Effect Study under THB Test

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“…When relative high bias (3.3V) was applied on small spacing (llOum) plating bar, ion migration was induced on package surface (Fig. I) in high humidity environment [10,11].…”
Section: Introductionmentioning
confidence: 99%
“…When relative high bias (3.3V) was applied on small spacing (llOum) plating bar, ion migration was induced on package surface (Fig. I) in high humidity environment [10,11].…”
Section: Introductionmentioning
confidence: 99%