Abstract:With plating bar pitch becoming finer, the risk of ion migration on package surface under Temperature Humidity Bias (THB) tests will be raised. In our research on fine pitch products with operating voltages of 1.5V, 1.8V and 3.3V, the effects of plating bar spacing and layout that may affect ion migration on the package surface in THB tests have been studied. The critical substrate plating bar spacing and bias values that cause ion migration have been determined. The effects of different PSR (green PSR and non… Show more
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