InP-based PIC integrated with Butt-joint Coupled Waveguide p-i-n PDs for 100GBaud Coherent Networks

Okimoto, Takuya; Yagi, Hideki; Ebihara, Koji; Yamazaki, K.; Okamoto, Satoru; Ohkura, Yusuke; Horino, Kazuhiko; Ashizawa, Ken; Ekawa, Mitsuru; Yoneda, Yoshihiro

doi:10.1364/ofc.2021.f2c.6

Cited by 2 publications

(1 citation statement)

References 3 publications

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“…A number of groups have implemented PDs using a variety of fabrication processes and material systems]. For example [643], present a recent PD architecture using InP waveguides with monolithic p-i-n PDs integrated in a two-step organometallic vapor phase epitaxy process. Also [644], present a Ge PD integrated on an SIO based waveguide platform.…”

Section: Statusmentioning

confidence: 99%

2023 Astrophotonics Roadmap: pathways to realizing multi-functional integrated astrophotonic instruments

Jovanovic,

Gatkine,

Anugu

et al. 2023

J. Phys. Photonics

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Photonic technologies offer numerous functionalities that can be used to realize astrophotonic instruments. The most spectacular example to date is the ESO Gravity instrument at the Very Large Telescope in Chile that combines the light-gathering power of four 8-m telescopes through a complex photonic interferometer. Fully integrated astrophotonic devices offer critical advantages for instrument development, including extreme miniaturization when operating at the diffraction-limit, plus integration, superior thermal and mechanical stabilization owing to the small footprint, and high replicability offering significant cost savings. Numerous astrophotonic technologies have been developed to address shortcomings of conventional instruments to date, including the development of photonic lanterns to convert from multimode inputs to single mode outputs, complex aperiodic fiber Bragg gratings to filter OH emission from the atmosphere, beam combiners enabling long baseline interferometry with for example, ESO Gravity, and laser frequency combs for high precision spectral calibration of spectrometers. Despite these successes, the facility implementation of photonic solutions in astronomical instrumentation is currently limited because of 1) low throughputs from coupling to fibers, coupling fibers to chips, propagation and bend losses, device losses, etc., 2) difficulties with scaling to large channel count devices needed for large bandwidths and high resolutions, and 3) efficient integration of photonics with detectors. In this roadmap, we identify 23 key areas that need further development. We outline the challenges and advances needed across those areas covering design tools, simulation capabilities, fabrication processes, the need for entirely new components, integration and hybridization and the characterization of devices. To realize these advances the astrophotonics community will have to work cooperatively with industrial partners who have more advanced manufacturing capabilities. With the advances described herein, multi-functional integrated instruments will be realized leading to novel observing capabilities for both ground and space based platforms, enabling new scientific studies and discoveries.

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Section: Statusmentioning

confidence: 99%

2023 Astrophotonics Roadmap: pathways to realizing multi-functional integrated astrophotonic instruments

Jovanovic,

Gatkine,

Anugu

et al. 2023

J. Phys. Photonics

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High Efficiency and High Bandwidth Double-Cladding Waveguide Photodetector Array for 400 Gbit/s Communication

Fan

Ye²,

Wang³

et al. 2022

Photonics

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A parallel array of 10 side-illuminated waveguide photodetectors (WGPDs) with double-cladding structure was designed and fabricated. In order to achieve high coupling efficiency to the fiber, the thicknesses of InGa0.24As0.53P cladding layers and In0.53Ga0.47As core layer were optimized. The array exhibited a uniform responsivity of 0.54 A/W at 1310 nm without anti-reflection (AR) coating and dark currents lower than 1.3 nA at −5 V. Each photodetector (PD) showed a bandwidth of over 30 GHz, amounting to 400 Gbit/s transmission capacity for the whole chip. In addition, numerical analysis showed that the fiber alignment tolerance to the chip edge along vertical and horizontal directions, when using a lensed fiber, were 1.8 μm and 4.6 μm, respectively. The simple fabrication, easy alignment capability and high performance make the photodetector array a competitive solution for future 400 Gbit/s parallel communication.

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InP-based PIC integrated with Butt-joint Coupled Waveguide p-i-n PDs for 100GBaud Coherent Networks

Cited by 2 publications

References 3 publications

2023 Astrophotonics Roadmap: pathways to realizing multi-functional integrated astrophotonic instruments

2023 Astrophotonics Roadmap: pathways to realizing multi-functional integrated astrophotonic instruments

High Efficiency and High Bandwidth Double-Cladding Waveguide Photodetector Array for 400 Gbit/s Communication

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