Inkjettable conductive adhesive for use in microelectronics and microsystems technology

Kolbe, Jana; Arp, Andreas; Calderone, Francesco; Meyer, Edouard Marc; Meyer, Wilhelm; Schaefer, H.; Stuve, Manuela

doi:10.1016/j.microrel.2006.02.017

Cited by 28 publications

(14 citation statements)

References 1 publication

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“…The electrically conducting fluids have a variety of technological and industrial applications such as field-induced pattern formation in colloidal dispersion, sensors, and electrically conductive adhesive technology (Kolbe et al 2007). EC of nanofluids containing metal, metal oxide, and CNT have been studied in the literature (Azizi-Toupkanloo et al 2014;Goharshadi and Azizi-Toupkanloo 2013b;Sarojini et al 2013).…”

Section: Introductionmentioning

confidence: 99%

Electrical conductivity, thermal conductivity, and rheological properties of graphene oxide-based nanofluids

Hadadian

Goharshadi

Youssefi³

2014

J Nanopart Res

154

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Highly stable graphene oxide (GO)-based nanofluids were simply prepared by dispersing graphite oxide with the average crystallite size of 20 nm, in polar base fluids without using any surfactant. Electrical conductivity, thermal conductivity, and rheological properties of the nanofluids were measured at different mass fractions and various temperatures. An enormous enhancement, 25,678 %, in electrical conductivity of distilled water was observed by loading 0.0006 mass fraction of GO at 25°C. GO-ethylene glycol nanofluids exhibited a non-Newtonian shearthinning behavior followed by a shear-independent region. This shear-thinning behavior became more pronounced at higher GO concentrations. The maximum ratio of the viscosity of nanofluid to that of the ethylene glycol as a base fluid was 3.4 for the mass fraction of 0.005 of GO at 20°C under shear rate of 27.5 s -1 . Thermal conductivity enhancement of 30 % was obtained for GO-ethylene glycol nanofluid for mass fraction of 0.07. The measurement of the transport properties of this new kind of nanofluid showed that it could provide an ideal fluid for heat transfer and electronic applications.

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Section: Introductionmentioning

confidence: 99%

Electrical conductivity, thermal conductivity, and rheological properties of graphene oxide-based nanofluids

Hadadian

Goharshadi

Youssefi³

2014

J Nanopart Res

154

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“…Besides the application of nanofluids for heat transfer purpose, the application of colloidal metals, particularly those based on silver nanoparticles, for direct patterning of electrically conductive structures and interconnects in electronic devices are increasing [9]. In fact, ink-jet-based direct writing technology has extended its original application of reprography into various new areas including printing interconnects in electronic circuits, printing color filters and thin film transistors (TFT) for liquid crystal displays (LCD), and microdispensing biomolecular arrays for biosensors [10].…”

Section: Introductionmentioning

confidence: 99%

“…On the other hand, high solid loadings are essential to convert the printed deposit of agglomerated nano-sized particles into highquality thin films. The tendency of nanoparticles to agglomeration should be considered as well because it directly influences the rheological behavior of nanofluids [5][6][7][8][9]. In other words, conductive inks should have a high solid loading, low viscosity, and must be stable and well dispersed.…”

Section: Introductionmentioning

confidence: 99%

Rheology and colloidal structure of silver nanoparticles dispersed in diethylene glycol

Tamjid

Guenther

2010

Powder Technology

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“…However, the difficult control of the adhesive shapes remains a huge limitation inherent to the adhesive properties and application techniques. Most processes for deposition of a glue into discrete adhesive layers are based on dispensing methods, such as screen printing or ink‐jet printing . Further developments of those techniques are limited by the difficulties in handling the viscous liquids, which affect the structural dimensions and precision of the adhesive interlayer.…”

Section: Introductionmentioning

confidence: 99%

Dewetting and photochemical crosslinking of adhesive pads onto lithographically patterned surfaces

Samyn

Biesalski²,

Prucker

et al. 2018

J of Applied Polymer Sci

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The design of structured adhesive interfaces can be realized by dewetting of a liquid adhesive onto substrates with hydrophilic and hydrophobic domains followed by photochemical crosslinking. The latter allows the creation of well-defined arrays of confined adhesive pads with a controlled geometry. In a first step, the surfaces are covered by a hydrophobic film and lithographically patterned through a mask with an array of spots with diameter of 2 mm. The adhesive can consequently be locally deposited by a dosing syringe and remains confined within the hydrophilic spots. By defining the volume of the adhesive droplets, the contact angle and height of the adhesive pads are controlled through pinning at the hydrophilic/hydrophobic interface, which prevents further spreading. Alternatively, the dip coating and spontaneous dewetting of liquid adhesive over the patterned surface provide a continuous fabrication method for adhesive pad arrays. In a second step, the geometry of the deposited adhesive pads is stabilized by partial crosslinking during different times under UV light. Finally, an adhesive joint is created by applying the counterface followed by full cross-linking. The adhesive strength and mechanical performance are further optimized by considering different crosslinking times and pattern designs.

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Inkjettable conductive adhesive for use in microelectronics and microsystems technology

Cited by 28 publications

References 1 publication

Electrical conductivity, thermal conductivity, and rheological properties of graphene oxide-based nanofluids

Electrical conductivity, thermal conductivity, and rheological properties of graphene oxide-based nanofluids

Rheology and colloidal structure of silver nanoparticles dispersed in diethylene glycol

Dewetting and photochemical crosslinking of adhesive pads onto lithographically patterned surfaces

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