Initial texture effects on the thermal stability and grain growth behavior of nanocrystalline Ni thin films

Kacher, Josh; Hattar, Khalid Mikhiel; Robertson, I. M.

doi:10.1016/j.msea.2016.08.045

Cited by 16 publications

(11 citation statements)

References 63 publications

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“…Film texture has also been demonstrated to augment thermal stability in nanocrystalline nickel thin films by locally constraining grain growth and in turn, producing bimodal grain size distributions 57 that are similar to the grain structures observed in the nanocrystalline tungsten thin films. To probe the effect of crystallographic orientation through the abnormal and continuous growth regimes, grain orientation and combined reliability-orientation maps were acquired at temperatures of 300, 450, and 650°C via PED and are depicted in Figs.…”

Section: Fig 6 Inverse Pole Figures For the Combined Reliability-ormentioning

confidence: 88%

Solute stabilization of nanocrystalline tungsten against abnormal grain growth

et al. 2017

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Microstructure and phase evolution in magnetron sputtered nanocrystalline tungsten and tungsten alloy thin films are explored through in situ TEM annealing experiments at temperatures up to 1000°C. Grain growth in unalloyed nanocrystalline tungsten transpires through a discontinuous process at temperatures up to 550°C, which is coupled to an allotropic phase transformation of metastable b-tungsten with the A-15 cubic structure to stable body centered cubic (BCC) a-tungsten. Complete transformation to the BCC a-phase is accompanied by the convergence to a unimodal nanocrystalline structure at 650°C, signaling a transition to continuous grain growth. Alloy films synthesized with compositions of W-20 at.% Ti and W-15 at.% Cr exhibit only the BCC a-phase in the as-deposited state, which indicate the addition of solute stabilizes the films against the formation of metastable b-tungsten. Thermal stability of the alloy films is significantly improved over their unalloyed counterpart up to 1000°C, and grain coarsening occurs solely through a continuous growth process. The contrasting thermal stability between W-Ti and W-Cr is attributed to different grain boundary segregation states, thus demonstrating the critical role of grain boundary chemistry in the design of solute-stabilized nanocrystalline alloys. transition with a focus on harsh environment sensors produced by additive manufacturing processes. Professor Trelewicz's research is on the science of interface engineered alloys with particular emphasis on high-strength and radiation-tolerant nanomaterials for extreme environment applications. His group couples in situ and analytical characterization tools with large-scale atomistic simulations to explore the thermal stability, mechanical behavior, and radiation tolerance of solute-stabilized nanocrystalline alloys, crystalline-amorphous nanolaminates, metallic glass matrix composites, and other unique hierarchical metallic structures. Professor Trelewicz is a recipient of the 2017 DOE Early Career

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Section: Fig 6 Inverse Pole Figures For the Combined Reliability-ormentioning

confidence: 88%

Solute stabilization of nanocrystalline tungsten against abnormal grain growth

et al. 2017

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“…Thermally-induced grain growth has been supported by the majority of experimental results so far [13][14][15][16][17][18][19][20][21][22][23][24][25][26]. A short summary of the grain size evolution during isothermal annealing of bulk electrodeposited NC Ni and Ni-Fe alloys is given in Table 1.…”

Section: Thermally-induced Grain Growthmentioning

confidence: 72%

A brief overview on grain growth of bulk electrodeposited nanocrystalline nickel and nickel-iron alloys

Zhu

Wang

et al. 2019

Reviews on Advanced Materials Science

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This review focuses on grain growth behaviors and the underlying mechanisms of bulk electrodeposited nanocrystalline nickel and nickel-iron alloys. Effects of some important factors on grain growth are described. During thermal-induced grain growth process, grain boundary migration plays a key role. For similar thermal conditions, due to grain boundary mobility with solute drag, limited grain growth occurs in nanocrystalline alloys, as compared to pure metals. Nonetheless, in the case of stress-induced grain growth process, there are a variety of mechanisms in samples having various deformation histories. As an example the grain growth of nanocrystalline nickel and Ni-20%Fe alloy with nearly the same grain-size distribution and average grain size is compared in this paper. Thermal analysis indicates nanocrystalline nickel is much more prone to rapid grain growth than nanocrystalline Ni-20%Fe alloy. Nevertheless, grain growth of nanocrystalline Ni-20%Fe is found to be more pronounced than nanocrystalline nickel during rolling deformation.

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“…In order to facilitate the observation, we only give the atomic distribution at the interface. 35,36 In order to investigate the stability of (001) SrHfO 3 /GaAs interface, we also calculate the interface binding energy, which is defined as 37…”

Section: Resultsmentioning

confidence: 99%

Interface spacing, stability, band offsets, and electronic properties on a (001) SrHfO3/GaAs interface: First-principles calculations

Shi

Xiu

et al. 2018

Journal of Applied Physics

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SrHfO 3 is a potential dielectric material for metal-oxide-semiconductor (MOS) devices. SrHfO 3 /GaAs interface has attracted attention due to its unique properties. In this paper, the interface properties of (001) SrHfO 3 /GaAs are investigated by first principles calculations based on density functional theory (DFT). First of all, the adsorption behavior of Sr, Hf and O on GaAs surface is investigated. O has lower adsorption energy on Ga surface than on As surface. Then, some possible (0 0 1) SrHfO 3 /GaAs configurations are considered to analyze the interface spacing, stability, band offsets and charge transfer. HfO 2 /Ga(2) and SrO/Ga(1) configurations in binding energy are lower than other interface configurations, indicating that they are more stable. At last, we study the electronic properties of HfO 2 /Ga(2) and SrO/Ga(1) configurations. The electronic density of states suggests that the systems exhibit metallic behavior. The band offset and charge transfer are related to the interface spacing. The valence band offset (VBO) and charge transfer will decrease with increasing interface spacing.

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Initial texture effects on the thermal stability and grain growth behavior of nanocrystalline Ni thin films

Cited by 16 publications

References 63 publications

Solute stabilization of nanocrystalline tungsten against abnormal grain growth

Solute stabilization of nanocrystalline tungsten against abnormal grain growth

A brief overview on grain growth of bulk electrodeposited nanocrystalline nickel and nickel-iron alloys

Interface spacing, stability, band offsets, and electronic properties on a (001) SrHfO3/GaAs interface: First-principles calculations

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