Influences of the moisture absorption on PBGA package’s warpage during IR reflow process

Warpage measurements of laminate based BGA packages at elevated temperatures and comparison with real board assembly behaviour

“…In [6] especially after JEDEC MSL2a humidity soaking significant effects on warpage were seen, in [7] from 0.25% moisture absorption on. In our study the impact of JEDEC MSL3 is investigated.…”

“…Some studies were published on large, thick PBGA packages (typically 1.7 mm and larger package body thickness, e.g. [6,7]). …”

“…In [6,7] it is shown for large and thick PBGAs that moisture absorption can change the warpage behavior during reflow. In [6] especially after JEDEC MSL2a humidity soaking significant effects on warpage were seen, in [7] from 0.25% moisture absorption on.…”

New dummy design and stiffener on warpage reduction in Ball Grid Array Printed Circuit Board

“…Much effort has been executed to reduce PCB warpage [6][7][8][9][10]. In the BGA PCB, modification for the PCB dummy design with various micro shapes has been done to control Cu portion ratio on the dummy to improve warpage defects.…”

Simulation and optimization of silicon thermal CVD through CFD integrating Taguchi method

“…Furthermore, by using Taguchi method, Wang et al [24] Greek symbols Ω 1 angular velocity of showerhead (rad/s) conditions of simultaneous supercritical fluid extraction and chemical derivation for the gas chromatographic-mass spectrometric determination of amphetamine and methamphetamine in an aqueous matrix. In addition, Taguchi method was employed to analyze influences of the moisture absorption on plastic ball grid array (PBGA) of package's warp during IR re-flow process [25]. The effects of the selected process parameters on the casting density and the subsequent optimal settings of the parameters have been accomplished with Taguchi method [26].…”