2014
DOI: 10.1088/0268-1242/29/12/122001
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Influence of transparent conductive oxides on passivation of a-Si:H/c-Si heterojunctions as studied by atomic layer deposited Al-doped ZnO

Abstract: In silicon heterojunction solar cells, the main opportunities for efficiency gain lie in improvements of the front-contact layers. Therefore, the effect of transparent conductive oxides (TCOs) on the a-Si:H passivation performance has been investigated for Al-doped zinc oxide (ZnO:Al) layers made by atomic layer deposition (ALD). It is shown that the ALD process, as opposed to sputtering, does not impair the chemical passivation. However, the field-effect passivation is reduced by the ZnO:Al. The resulting dec… Show more

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Cited by 45 publications
(38 citation statements)
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References 24 publications
(32 reference statements)
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“…Numerical simulations suggested that the τ eff variation at low Δn is caused by the presumed existence of an ultrathin highly defective (recombination-active) layer in-between the a-Si:H(p) layer and ITO [28]. However, although some TCO deposition methods can cause damage to underlying films [31], the described τ eff variations were also observed using ultrasoft deposition techniques such as atomic layer deposition [29], [30], and vanished after TCO removal via chemical etching [27], [30]. Therefore, the most accepted physical interpretation associates this phenomenon rather to the WF of the bare TCO film, being lower than the one of the aSi:H(p) layer.…”
Section: ) Impact Of Doped A-si:h Layersmentioning
confidence: 99%
See 1 more Smart Citation
“…Numerical simulations suggested that the τ eff variation at low Δn is caused by the presumed existence of an ultrathin highly defective (recombination-active) layer in-between the a-Si:H(p) layer and ITO [28]. However, although some TCO deposition methods can cause damage to underlying films [31], the described τ eff variations were also observed using ultrasoft deposition techniques such as atomic layer deposition [29], [30], and vanished after TCO removal via chemical etching [27], [30]. Therefore, the most accepted physical interpretation associates this phenomenon rather to the WF of the bare TCO film, being lower than the one of the aSi:H(p) layer.…”
Section: ) Impact Of Doped A-si:h Layersmentioning
confidence: 99%
“…Earlier, it was already established that deposition of TCOs on ip stacks (i.e., hole collectors) can result in additional Δn dependences of the wafer surface passivation [27]- [30], leading to a reduction in τ eff values at low Δn values (Δn < 10 15 cm −3 ). This was reported for a variety of TCOs, including aluminum doped zinc oxide (ZnO:Al) [27], [29], [30] and ITO films [28], [29]. Numerical simulations suggested that the τ eff variation at low Δn is caused by the presumed existence of an ultrathin highly defective (recombination-active) layer in-between the a-Si:H(p) layer and ITO [28].…”
Section: ) Impact Of Doped A-si:h Layersmentioning
confidence: 99%
“…7,16 Besides achieving such high mobility values, the main advantages of the ALD process are the low temperature processing (post-crystallization can take place at temperatures as low as 150 o C), the ability to conformally deposit on non-planar surfaces, and the fact that plasma-induced damage, typically encountered during sputtering ("sputter damage") 17 , is absent during ALD. 18,19 Despite the importance of the crystallization step in realizing high-mobility In2O3:H, little is known about the crystallization process itself. Therefore, in this contribution, the crystallization process of ALD In2O3:H is studied in detail by electron microscopy to gain a deeper understanding of the physical origin of the very high mobility.…”
Section: Introductionmentioning
confidence: 99%
“…ALD can generate highly conformal ZnO coatings, with competitive electrical and optical properties for relatively thin films (<100 nm). Both Al‐ and B‐doping have been successfully employed for ALD; the Al‐doped process yielded resistivities as low as 7 · 10 −4 Ω · cm for films as thin as 75 nm, and can produce suitable contacts for heterojunction c‐Si/a‐Si solar cells …”
Section: Cvd Processes For (Doped) Zno Layersmentioning
confidence: 99%
“…In some cases, there are very strict requirements for the thickness of the TCO, e.g. in Si‐heterojunction solar cells, the TCO thickness must be maintained at 75 nm for anti‐reflective purposes . In view of these requirements, the ETP‐CVD technique (and indeed, PECVD in general) faces intrinsic challenges due to the frequently observed resistivity gradient: At low film thicknesses, the lateral grain sizes are typically too small, limiting the electron mobility and therefore conductivity.…”
Section: Final Considerations and Conclusionmentioning
confidence: 99%