Influence of thermal aging on the reliability of electrically conductive adhesives

Barto, Seba; Cinert, Jakub; Mach, Pavel

doi:10.1109/siitme.2011.6102741

Cited by 5 publications

(2 citation statements)

References 15 publications

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“…Therefore, the actual temperature usage limit for thermoset ACFs can be higher than the attachment temperature, unlike solder materials. Exceeding the T g may still cause considerable reliability concerns, such as decreased stiffness [ 20 ] and post-curing, leading to brittleness [ 21 , 22 ]. Both promising and discouraging results for using polymer-based adhesive interconnection materials have been reported, but the field is not widely studied [ 2 , 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 , 31 , 32 ].…”

Section: Introductionmentioning

confidence: 99%

High-Temperature Storage Testing of ACF Attached Sensor Structures

et al. 2015

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Several electronic applications must withstand elevated temperatures during their lifetime. Materials and packages for use in high temperatures have been designed, but they are often very expensive, have limited compatibility with materials, structures, and processing techniques, and are less readily available than traditional materials. Thus, there is an increasing interest in using low-cost polymer materials in high temperature applications. This paper studies the performance and reliability of sensor structures attached with anisotropically conductive adhesive film (ACF) on two different organic printed circuit board (PCB) materials: FR-4 and Rogers. The test samples were aged at 200 °C and 240 °C and monitored electrically during the test. Material characterization techniques were also used to analyze the behavior of the materials. Rogers PCB was observed to be more stable at high temperatures in spite of degradation observed, especially during the first 120 h of aging. The electrical reliability was very good with Rogers. At 200 °C, the failures occurred after 2000 h of testing, and even at 240 °C the interconnections were functional for 400 h. The study indicates that, even though these ACFs were not designed for use in high temperatures, with stable PCB material they are promising interconnection materials at elevated temperatures, especially at 200 °C. However, the fragility of the structure due to material degradation may cause reliability problems in long-term high temperature exposure.

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Section: Introductionmentioning

confidence: 99%

High-Temperature Storage Testing of ACF Attached Sensor Structures

et al. 2015

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“…The influence of the surface finish of rigid PCBs on electric resistance [6], and on reliability [7] of glued joints has been looked into, but again the influence of electrically conductive adhesive quantity on the mechanical reliability of glued joint on flexible substrate has not been researched.…”

Section: Theorymentioning

confidence: 99%

Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

Hirman

Steiner²

2016

Journal of Electrical Engineering

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This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives "EPO-TEK H20S" and "MG 8331S" on three types of substrates (FR-4, MELINEX ST504, DuPont TM Pyralux AC). These joints were made by gluing chip resistors 1206, 0805 and 0603, with two curing profiles for each adhesive. Different thicknesses of stencil and reductions in the size of the hole in stencils were used for this experiment. These differences have an effect on the quantity of conductive adhesives which must be used on the samples. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different curing profiles, various types of substrates, and different quantities of adhesives on the mechanical strength of the joint.

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