Influence of the target composition on reactively sputtered titanium oxide films

Preparation and sintering of indium–gallium–zinc oxide ceramics with different zinc oxide contents

“…The effects of various sputtering parameters, particularly the oxygen partial pressure, on the properties of IGZO films have been the focus of previous research [1][2][3][4][5][6][7][8][9]. Recently, several studies [13][14][15][16][17][18][19][20][21] have demonstrated that the characteristics of the sputtering targets for various oxide thin films play important roles on the preparation and the performances of sputtered films. Thus, in addition to the sputtering parameters, the sputtering target is an important factor in determining the properties of oxide films.…”

“…The characteristics of the oxide targets, including the sintered density [13,14], microstructural uniformity [15], stoichiometry [17][18][19], and electrical properties [20,21], have been found to obviously affect both the sputtering process and the film properties. A tin-doped indium oxide (ITO) target with higher sintered density and more homogeneous SnO 2 distribution can suppress the arcing phenomenon and nodule generation during sputtering [14,15].…”

Preparation and characteristics of thermal resistance polysiloxane/Al composite coatings with low infrared emissivity

“…As we know, coating exterior surface of the aircraft with low emissivity materials can greatly decrease the probability of being detected by infrared detector. In the past decade, several kinds of materials with low infrared emissivity, such as composite ceramic [1][2][3], silver and aluminum [4], thinfilms [5][6][7][8], bio-electret composite [9,10], and inorganic-organic composite coatings [11][12][13][14] have been developed. Especially, the inorganic-organic composite coatings, composed of hard and soft materials intertwined to provide both useful functionality and mechanical integrity [15][16][17][18][19][20], have received increasing attention.…”

A study of the non-uniform current density influence in reactive sputtering deposition

“…To meet this demand, it is necessary to have very good process control of such processes [5] . Steady-state hysteresis was reasonably well described by the Berg model [5][6] , and more recently extensions to this model have published [7][8][9][10][11][12][13] . The majority of these models of the reactive magnetron sputtering assume an uniform shape of the discharge current density.…”