2014
DOI: 10.5755/j01.ms.20.3.4602
|View full text |Cite
|
Sign up to set email alerts
|

Influence of Strain-Hardened Zones and Intermetallic Layers of Explosion Welded and Heat Treated Al/Cu Laminated Metal Composites on the Evolution of Thermal Conductivity Coefficient

Abstract: In this study laminated Al/Cu composite was obtained by explosion welding. The effect of strain-hardened zones and the intermetallic layer on thermal conductivity coefficient was investigated. For this purpose the specimens after explosion welding and after subsequent annealing to obtain the intermetallic layer were studied by X-ray methods and means of optical microscopy to determine the phase composition and the width of intermetallic layer. The microhardness tests were carried out to identify the width of t… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
1
0

Year Published

2016
2016
2023
2023

Publication Types

Select...
5
1

Relationship

0
6

Authors

Journals

citations
Cited by 7 publications
(2 citation statements)
references
References 16 publications
0
1
0
Order By: Relevance
“…These materials have high heat resistance and wear resistance and they also have low heat and electrical conductivity. [1].…”
Section: Introductionmentioning
confidence: 99%
“…These materials have high heat resistance and wear resistance and they also have low heat and electrical conductivity. [1].…”
Section: Introductionmentioning
confidence: 99%
“…Lee et al (2005) have reported the decline of electrical conductivity caused by the emergence of intermetallics in Al/Cu bimetals however in the study of Acarer (2012) no significant decrease in electrical conductivity was observed after the formation of small quantities of CuAl 2 phase between metals. According to the study of Trykov et al (2014) the decrease in thermal conductivity value is observed with the formation of intermetallics. The kinetics of diffusion processes, emerging in the composite under heat treatment have been widely investigated at a range of different temperatures by Abbasi et al (2010); Guo et al (2010); Wang et al (2014); however the previous research usually considered temperatures of solid state diffusion processes, while the impact of higher temperatures on the bond area is insufficiently explored.…”
Section: Introductionmentioning
confidence: 99%