Research of Heat Resistance and Thermophysical Properties of the Diffusion Zone Formed by Annealing by Contact Melting Mode of the Layered Metal-Intermetallic Composite of the Cu-Al System

Abstract

The results of studying the effect of isothermal annealing on structural, phase transformations, and thermal diffusivity in the diffusion zone of a Cu-Al layered metal-intermetallic composite (LMIC), obtained using technology including explosion welding, pressure treatment and heat treatment, are presented. It was found that, at 530 °C (the highest temperature, excluding the formation of a liquid phase in this system) with a holding time of up to 1000 h, there are no structural phase transformations in the Al (Cu)/CuAl2 metal-intermetallic composition, and a slight increase in its mass is associated with the formation of a thin dense protective oxide film on the surface. The thermal diffusivity of Cu-Al LMIC, obtained after removal of copper residues from the surface of the diffusion zone, is 50–60 W/m×K, which is significantly lower than that of copper (410 W/m×K) and aluminum (220 W/m×K).