1995
DOI: 10.1143/jjap.34.409
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Influence of Fe Contamination in Czochralski-Grown Silicon Single Crystals on LSI-Yield Related Crystal Quality Characteristics

Abstract: Influence of Fe contamination in CZ-grown silicon single crystal on oxidation-induced stacking fault (OSF) generation density, carrier recombination and generation lifetimes, and gate oxide integrity (GOI) yield characteristics was experimentally investigated. Two Fe-doped silicon ingots were grown and tested. Concentration of Fe-B ([Fe-B]) in these silicon ingots measured by deep level transient spectroscopy (DLTS) was about 5×1011 cm-3 and 5×1012 cm-3, respectively. OSF density generated by three-step anne… Show more

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Cited by 17 publications
(8 citation statements)
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“…[25][26][27] There is evidence that Fe enhances the formation of O-induced stacking faults. [28][29][30] These correlations do not necessarily imply the existence of Fe-O complexes since Si i 's are generated by oxygen precipitation. Electrical studies 31 of a deep hole trap, the T 3 center in Cz-Si, show that it consists of two defects.…”
Section: Experimental Informationmentioning
confidence: 99%
“…[25][26][27] There is evidence that Fe enhances the formation of O-induced stacking faults. [28][29][30] These correlations do not necessarily imply the existence of Fe-O complexes since Si i 's are generated by oxygen precipitation. Electrical studies 31 of a deep hole trap, the T 3 center in Cz-Si, show that it consists of two defects.…”
Section: Experimental Informationmentioning
confidence: 99%
“…However, care must be taken when trying to compare results from those techniques, as in both cases effective MCLTh are measured and the surface component has a different impact on the measured values from these methods. 28 No appreciable influence of the substrate doping was observed on the MCLT properties of p-type wafers with resistivity in the range of 6 to 36 (1 cm.…”
Section: Introductionmentioning
confidence: 98%
“…During the transient PTR signal evolution, various kinetic, annealing 15 and redistribution Fe processes can take place even at very low fluences changing thermoelectronic properties in p-type Si wafers. 12,14,16 The rapid laser-scan conditions produce minimal disturbance and redistribution of Fe centers and thus offer a more reliable mapping of the original Fe distribution.…”
Section: Resultsmentioning
confidence: 99%
“…In this work, this method has been used to measure µ-PCD lifetimes before and after Fe-B dissociation and to extract [Fe] concentrations. 7,8,[12][13][14] The lifetime/iron concentration dependence is strong for p-Si with Fe in interstitial state and much less for Fe as FeB complex. For low injection levels the lifetime in the activated Fe i state is smaller that in the FeB complex.…”
Section: (Received June 29 2000; Accepted October 30 2000)mentioning
confidence: 99%