Influence analysis of dwell time on focused ion beam micromachining in silicon

Fu, Yongqi; Bryan, Ngoi Kok Ann; Shing, Ong Nan; Wyan, Hung Nguyen Phu

doi:10.1016/s0924-4247(99)00282-4

Cited by 28 publications

(21 citation statements)

References 3 publications

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“…Instead, the workers found WLI to be more useful for measuring large depths while preserving features and being able to easily measure vertical sidewalls. 17 In tribology, analysis software can extract statistical surface roughness parameters of worn surfaces, which can be compared with analytical models of surface topography generated by tribological processes, e.g. machining.…”

Section: Discussion Examplementioning

confidence: 99%

Characterization of Surface Modifications by White Light Interferometry: Applications in Ion Sputtering, Laser Ablation, and Tribology Experiments

Baryshev

Erck

Moore³

et al. 2013

JoVE

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In materials science and engineering it is often necessary to obtain quantitative measurements of surface topography with micrometer lateral resolution. From the measured surface, 3D topographic maps can be subsequently analyzed using a variety of software packages to extract the information that is needed.In this article we describe how white light interferometry, and optical profilometry (OP) in general, combined with generic surface analysis software, can be used for materials science and engineering tasks. In this article, a number of applications of white light interferometry for investigation of surface modifications in mass spectrometry, and wear phenomena in tribology and lubrication are demonstrated. We characterize the products of the interaction of semiconductors and metals with energetic ions (sputtering), and laser irradiation (ablation), as well as ex situ measurements of wear of tribological test specimens.Specifically, we will discuss: i. Aspects of traditional ion sputtering-based mass spectrometry such as sputtering rates/yields measurements on Si and Cu and subsequent time-to-depth conversion. ii. Results of quantitative characterization of the interaction of femtosecond laser irradiation with a semiconductor surface. These results are important for applications such as ablation mass spectrometry, where the quantities of evaporated material can be studied and controlled via pulse duration and energy per pulse. Thus, by determining the crater geometry one can define depth and lateral resolution versus experimental setup conditions. iii. Measurements of surface roughness parameters in two dimensions, and quantitative measurements of the surface wear that occur as a result of friction and wear tests.Some inherent drawbacks, possible artifacts, and uncertainty assessments of the white light interferometry approach will be discussed and explained. Video LinkThe video component of this article can be found at

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Section: Discussion Examplementioning

confidence: 99%

Characterization of Surface Modifications by White Light Interferometry: Applications in Ion Sputtering, Laser Ablation, and Tribology Experiments

Baryshev

Erck

Moore³

et al. 2013

JoVE

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“…3(a). 19 The distance between two adjacent pixel points is called pixel distance. After scanning all the points on a particular line in the sputtering area, the beam moves to the next line.…”

Section: Sputtering Mechanismmentioning

confidence: 99%

A review of focused ion beam sputtering

Ali

Hung

2010

Int. J. Precis. Eng. Manuf.

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NOMENCLATURE η = atomic density α = coefficient of energy transfer φ = ion flux η = atomic density of the target σ = standard deviation δ = pixel spacing (nm) (distance between two adjacent beam centres) φ (x,y) = ion flux at point (x, y) ε b = bonding energy per atom pair ∆Z ij = sputtering depth at each point (x i , y i ), a = peak-to-valley height of the variable cumulative intensity profile A = aperture size (nm) B = beam function d = ion dose f x,y = energy density function of Gaussian beam in two dimensions I = total ion beam current J(x,y) = beam current intensity at any point x,y J 0 = peak current intensity (at the centre of the beam) K 1 , K 2 = material factor for different crystalline structure, and other properties respectively M = material function m i , m t = atomic mass of the incident (sputtering) ion, and target material respectively MRR = material removal rate R = function representing the sputtered surface profile r = FIB radius (nm) R a , R max = average and maximum (peak-to-valley height) surface roughness respectively S(θ) = angle dependant sputtering yield T C = critical dwell time or sputtering time T d = dwell time t x,y = dwell time in second of the ion beam at point (x i , y j ) U 0 = atomic binding energy V = acceleration voltage Y(E) = normal sputtering yield z = sputtered depth Z i , Z t = nuclear charge of the incident ion and target atom respectively This paper reviews the applications of focused ion beam (FIB) sputtering for micro/nano fabrication. Basic principles of FIB were briefly discussed, and then empirical and fundamental models for sputtering yield, material removal rate, and surface roughness were presented and compared. The empirical models were more useful for application compared to fundamental models. Fabrication of various micro and nano structures was discussed. Trimmed atomic force microscope (AFM) tips were tested in measurement and imaging of high aspect ratio nanopillars where higher accuracy and clarity were observed. Micromilling tool fabricated using FIB sputtering was used to machine microchannels. Slicing and dwell time control approaches on FIB sputtering were presented for the fabrication of three dimensional microcavities. The first approach is preferred for practical applications.The maximum aspect ratio of 13:1 of the microstructures was achieved. The minimum size of the nanopore was in the range of 2-10 µm. Cavities of microgear of 70 µm outside diameter were sputtered with submicrometer accuracy and 2-5 nm average surface roughness. The microcavities were then filled with polymer in a subsequent micromodling process. The replicated microcomponents were inspected with scanning electron microscope where faithful duplication of accuracy and surface texture of the cavity was observed.

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“…Several studies about the relation of beam setting parameters and dwell time have been done. [6][7][8][9][10][11][12][13] Using an energetic (30kV) gallium ion beam and changing beam current for the beam setting conditions, this study investigates the influence of on-target beam control parameters with respect to the deposited dimensions and shapes. The possible working range is considered as appeared effects by adjusting on-target beam control the test deposition process.…”

Section: Introductionmentioning

confidence: 99%

Comparative studies of parameters calibration for focused ion beam deposition

Kim

Synn²,

Kim

2010

Int. J. Precis. Eng. Manuf.

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This paper describes the interaction between operating parameters of target wafer surface. We use an organometallic (C) precursor gas in the focused ion beam deposition process. Under the beam intensity conditions (30kV), the influences of the on-target beam control parameters, such as dwell time, beam spacing, minimum frame time and scan type, were investigated by the deposition tests. The analysis was carried out with the variation of dimensions and shapes of the single pattern. The operating parameters considered in this research are implemented in the next double-patterning deposition. The test presented how their interaction appeared on the processing results. The analysis configured out the FIB induced deposition of single pattern with the variation of operating parameters. Additionally the result shows that the sequent beam job influenced the double-patterning deposition significantly. On-beam target conditions should be optimized for the target complicated shapes and high aspect-ratios.

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Influence analysis of dwell time on focused ion beam micromachining in silicon

Cited by 28 publications

References 3 publications

Characterization of Surface Modifications by White Light Interferometry: Applications in Ion Sputtering, Laser Ablation, and Tribology Experiments

Characterization of Surface Modifications by White Light Interferometry: Applications in Ion Sputtering, Laser Ablation, and Tribology Experiments

A review of focused ion beam sputtering

Comparative studies of parameters calibration for focused ion beam deposition

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