Inductively coupled plasma etching of tapered via in silicon for MEMS integration

Ren, Zhong; McNie, Mark E.

doi:10.1016/j.mee.2015.03.071

Cited by 8 publications

(4 citation statements)

References 10 publications

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“…Such a process therefore requires at least two power supplies: one for the plasma source where the ions and reactive radicals are formed, and another to negatively polarize (bias) the substrate to attract and accelerate ions to the surface being etched away. Because this technique makes it possible to etch structures of a very high aspect ratio (HAR), it is widely used in the semiconductor industry: from Through-Silicon Vias (TSV) manufacturing [21], through nanocarbon film etching [22], to GaN and Si surface treatment [23], [24].…”

Section: A Chemical Vapor Depositionmentioning

confidence: 99%

High Performance Power Supplies for Plasma Materials Processing

2021

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Integrated circuits, flat panel displays, solar panels, architectural glass, high resolution camera and many other products are landmarks of the 21 st century. All of these different everyday objects have one thing in common -they are manufactured using plasma processing techniques. The aim of this paper is to introduce this silent hero of modern industry, to a broader audience. An evaluation is made of common types of power converters within the scope of plasma processing applications, while the key requirements and future challenges for such power supplies are discussed.INDEX TERMS Plasma applications, plasma materials processing, power conversion, power electronics.

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Section: A Chemical Vapor Depositionmentioning

confidence: 99%

High Performance Power Supplies for Plasma Materials Processing

2021

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“…The hourglass profile of tapered pillars was achieved by molding PDMS into a Si substrate processed on both sides by alternating anisotropic deep reactive ion etching (DRIE, Bosch process) and isotropic etching of silicon. Such etching approach creates a staircase-like profile while precisely defining the tapering angle of the etched holes and the location of their conjunction [3], [4]. Fine tuning of the tapering angle was controlled by knowing the etch rates of both isotropic and anisotropic etching processes.…”

Section: Fabricationmentioning

confidence: 99%

Highly Reproducible Tissue Positioning with Tapered Pillar Design in Engineered Heart Tissue Platforms

Mummery

Sarro

Mastrangeli

2023

2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)

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We present a novel design of elastic micropillars for tissue self-assembly in engineered heart tissue (EHT) platforms. The innovative tapered profile confines reproducibly the tissue position along the main micropillar axis, increasing the accuracy of tissue contraction force measurement. Polydimethylsiloxane-based pillars were designed and fabricated by wafer-level molding in an hourglass shape, with symmetric tapering producing a restriction for tissue movement in the middle of the pillars' length. Confinement efficacy of the new geometry was validated by comparing the tissue performance in straight versus tapered (75° or 80° tapering angle) micropillars. While in all three cases compact tissues formed successfully, for both tapered designs the functionality assays evidenced yield increase from 15% to 100%, higher spatial tissue confinement, and correspondingly higher accuracy and smaller dispersion in measurements of tissue contraction force.

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Section: Introductionmentioning

confidence: 99%

“…Inductively coupled plasma (ICP) source has been widely used in semiconductor material processing due to its advantages such as low electron temperature and high plasma density. [ 1–3 ] To improve the production efficiency and reduce the fabrication costs of microelectronic devices, large‐area plasma sources have been proposed. However, when the coil length becomes comparable to the wavelength of radio frequency (RF) source, the standing wave is excited in the coil and produces strong non‐uniform plasma over the wafer surface.…”

Section: Introductionmentioning

confidence: 99%

Hybrid simulation of the plasma characteristics in a dual‐frequency dual‐antenna inductively coupled plasma discharge

Sun,

Yang,

Shao

et al. 2023

Contrib. Plasma Phys

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Dual‐frequency (DF) dual‐antenna inductively coupled plasma (ICP) sources have been proposed as one of the methods to produce large‐area uniform plasma. In this study, a hybrid model, consisting of a fluid module and an electron Monte Carlo (eMC) module, is used to further investigate the modulation of the plasma characteristics (i.e., induced electric field, electron energy distribution, electron heating mechanism, electron temperature, and plasma density) by the low‐frequency (LF) and high‐frequency (HF) currents in a DF argon discharge. When the inner LF current increases from 12 to 22 A at a fixed outer HF current of 10 A, the induced electric field is strengthened near the LF coil and weakened near the HF coil. The fraction of high‐energy electrons at different spatial positions increases with the increase of LF current, which is caused by the sufficient collision heating in the skin layer of LF source, leading to an increase in electron temperature. When the outer HF current rises from 7 to 13 A with the inner LF current fixed at 17 A, the induced electric field is enhanced near the HF coil and weakened near the LF coil. The fraction of low‐energy electrons at different positions increases with the increase of HF current since the energetic electrons from the skin layer of HF source are cooled due to the ionization, excitation, and stepwise ionization collisions between electrons and neutral particles, as well as the weakened induced electric field near the LF coil. As a result, the electron temperature drops with the increase of HF current. Moreover, when the LF and HF currents increase, the plasma density increases, and the distribution of plasma density is also significantly modulated.

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Inductively coupled plasma etching of tapered via in silicon for MEMS integration

Cited by 8 publications

References 10 publications

High Performance Power Supplies for Plasma Materials Processing

High Performance Power Supplies for Plasma Materials Processing

Highly Reproducible Tissue Positioning with Tapered Pillar Design in Engineered Heart Tissue Platforms

Hybrid simulation of the plasma characteristics in a dual‐frequency dual‐antenna inductively coupled plasma discharge

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