Indentation Crack Initiation and Ductile to Brittle Transition Behavior of Fused Silica

Yao, Peng; Wang, Wei; Huang, Chuan Zhen; Wang, Jun; Zhu, Hong Tao; Kuriyagawa, Tsunemoto

doi:10.4028/www.scientific.net/amr.797.667

Cited by 10 publications

(6 citation statements)

References 9 publications

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“…𝑑 𝑎𝑣𝑔 = 68𝑀 −1.4 𝑁 𝑠 (11) where 𝑀 is the mesh of the grinding wheel, 𝑁 𝑠 is the number of CeO2 particles in unit volume.…”

Section: The Undeformed Chip Thicknessmentioning

confidence: 99%

“…temperature [7,8], strain rate [9], and multi-axial tensile and compressive stress of the workpiece [10] affect the material removal mechanism. Yao et al [11] disscussed the typical damage microtopography of fused silica by observing the surface and cross-section of indentations, and the ductile to brittle transition penetration depth of fused silica under Vickers indentation was 180nm. Feng et al [12] studied the crack behaviors under the influence of interaction between the arranged grits during grit-arranged grinding BK7 glass through the double scratch tests.…”

Section: Introductionmentioning

confidence: 99%

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Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Zhang¹,

Yao

Li³

et al. 2022

Preprint

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Prolonged polishing deteriorates the shape accuracy of an optical element and reduces production efficiency simultaneously. In order to reduce the amount of polishing and polishing time, even obtain polish-free fine surfaces, a cerium oxide (CeO2) slurry assisted grinding (SAG) is investigated. A novel theoretical model was established to predict the surface roughness of the workpiece processed by CeO2 SAG. The modelling considered the effects of the protrusion height of active grains in the grinding wheel and the sizes and mass fractions of CeO2 particles in the grinding zone on undeformed chip thickness (UCT). Then, the mechanism of CeO2 SAG was investigated through nanoindentation method. Indentation hardness and energy spectrum of the surface were estimated to verify the softened layer. The results showed that the model of surface roughness was well consistent with the experiment. The CeO2 particle size significantly influenced on the surface roughness than the mass fraction. The load-bearing effect of larger CeO2 particle size reduced the protruding height of the grinding wheel grains and reduced the UCT to a greater extent in grinding process. The chemical reaction between CeO2 slurry and BK7 glass results in a softening layer which enhances the critical load and critical depth of ductile-brittle transition of grinding. Finally, the optimized parameters were used for CeO2 SAG of an ellipsoid BK7 optics.

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“…𝑑 𝑎𝑣𝑔 = 68𝑀 −1.4 𝑁 𝑠 (11) where 𝑀 is the mesh of the grinding wheel, 𝑁 𝑠 is the number of CeO2 particles in unit volume.…”

Section: The Undeformed Chip Thicknessmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Zhang¹,

Yao

Li³

et al. 2022

Preprint

Self Cite

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show abstract

“…Considering the hardness of iron lapping plate and external load, the model focuses on three-body and brittle machining [11]. In the three-body and brittle lapping process, the force borne by the single abrasive can be defined as in Equation 1 [15,16].…”

Section: Remove Rate Model and Subsurface Defect Modelmentioning

confidence: 99%

High-Efficiency and Low-Damage Lapping Process Optimization

et al. 2020

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The silica opticsare widely applied in the modern laser system, and its fabrication is always the research focus. In the manufacturing process, the lapping process occurs between grinding and final polishing. However, lapping processes optimizations focus on decreasing the depth of sub-surface damage (SSD) or improving lapping efficiency individually. So, the optimum balance point between efficiency and damageshould be studied further. This manuscript establishes the effective removal rate of damage (ERRD)model, and the relationship between the ERRD and processing parameters is simulated. Then, high-efficiency, low-damage lapping processing routine is established based on the simulation. The correctness and feasibility are validated. In this work, the optimized method is confirmed that it can improve efficiency and decrease damage layer depth in the lapping process which promotes the development of optics in low-damage fabrication.

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“…[4] Once the fused silica is damaged, the damage will rapidly increase. [5][6][7] Because the damage to the rear surface is more severe, the damage growth will generally appear first on the rear surface. [8] This not only limits the overall performance of a high-power laser device but also hinders the continuous increase of the output energy of high-power laser device.…”

Section: Introductionmentioning

confidence: 99%

Damage characteristics of laser plasma shock wave on rear surface of fused silica glass*

Shen¹,

Feng²,

Jiang³

et al. 2019

Chinese Phys. B

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The damage to the rear surface of fused silica under the action of high power laser is more severe than that incurred by the front surface, which hinders the improvement in the energy of the high power laser device. For optical components, the ionization breakdown by laser is a main factor causing damage, particularly with laser plasma shock waves, which can cause large-scale fracture damage in fused silica. In this study, the damage morphology is experimentally investigated, and the characteristics of the damage point are obtained. In the theoretical study, the coupling and transmission of the shock wave in glass are investigated based on the finite element method. Thus, both the magnitude and the orientation of stress are obtained. The damage mechanism of the glass can be explained based on the fracture characteristics of glass under different stresses and also on the variation of the damage zone’s Raman spectrum. In addition, the influence of the glass thickness on the damage morphology is investigated. The results obtained in this study can be used as a reference in understanding the characteristics and mechanism of damage characteristics induced by laser plasma shock waves.

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Indentation Crack Initiation and Ductile to Brittle Transition Behavior of Fused Silica

Cited by 10 publications

References 9 publications

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

High-Efficiency and Low-Damage Lapping Process Optimization

Damage characteristics of laser plasma shock wave on rear surface of fused silica glass*

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