Incorporating the Role of Stress on Electromigration in Power Grids with Via Arrays

Mishra, Vivek; Jain, Pooja; Marella, Sravan K.; Sapatnekar, Sachin S.

doi:10.1145/3061639.3062266

Cited by 7 publications

(6 citation statements)

References 9 publications

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“…Some of them are based on numerical simulations while the others are based on analytical solutions. At an early time, Vivek Mishra et al modeled the impact of EM in Cu interconnects on power grid integrity with using probability analysis [36,[38][39][40]43]. Figure 6 shows the CDF plots for IR drop of a studied power grid for different circuit lifetime [40].…”

Section: Modeling and Simulation Methodologiesmentioning

confidence: 99%

“…Third, weakest-link statistics considers a single branch failure leads to failure of studied interconnect trees which is not true in state-of-the-art ICs, especially for power grids with a mesh structure [35]. Therefore, some physics-based EM compact models have been proposed to incorporate the atom movement between segments [36][37][38][39][40][41][42][43][44]. It is noted that there are already several excellent reviews on relevant topics in [34,[45][46][47][48], but they are mainly on power grids.…”

Section: Introductionmentioning

confidence: 99%

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Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects

2022

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The advance of semiconductor technology not only enables integrated circuits with higher density and better performance but also increases their vulnerability to various aging mechanisms which occur from front-end to back-end. Analysis on the impact of aging mechanisms on circuits’ reliability is crucial for the design of reliable and sustainable electronic systems at advanced technology nodes. As one of the most crucial back-end aging mechanisms, electromigration deserves research efforts. This paper introduces recent studies on physics-based modeling of electromigration aging of on-chip interconnects. At first, the background of electromigration is introduced. The conventional method and physics-based modeling for electromigration are described. Then studies on how electromigration affects powers grids and signal interconnects are discussed in detail. Some of them focus on the comprehensiveness of modeling methodology, while others aim at the strategies for improving computation accuracy and speed and the strategies for accelerating/decelerating aging. Considering the importance of electromigration for circuit reliability, this paper is dedicated to providing a review on physics-based modeling methodologies on electromigration and their applications for integrated circuits interconnects.

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Section: Modeling and Simulation Methodologiesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects

2022

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“…Since copper dual damascene interconnection is known to have early-stage void nucleation [6], the TTF of the slit voids of via was assumed to be modeled by void growth time. In the void growth phase, the void grows in the fixed direction and the wire resistance starts to increase over time to a steady-state value.…”

Section: A Em Analysismentioning

confidence: 99%

“…When the void covers the entire via, via is regarded as an open circuit and needs to be removed. Hence, each node's voltage drop and temperature distribution must be updated to calculate TTF for a voltage drop violation of the power grid to occur [6].…”

Section: B Power Grid and Modelingmentioning

confidence: 99%

“…Moreover, a preliminary study regarding via array structure was carried out in [4], which took current crowding problems into account. Recent efforts [6] have been undertaken to investigate EM-induced variation of stress of via arrays using the finite element analysis (FEA) method. The stress of every via structure is simulated and passed to the SPICE to calculate the time-to-failure (TTF) distribution of the power grid.…”

Section: Introductionmentioning

confidence: 99%

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A Power Grids Electromigration Analysis with Via Array Using Current-Tracing Model

Wang

Cai

Zhou

2021

2021 IEEE International Symposium on Circuits and Systems (ISCAS)

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Electromigration (EM) has been considered to be a severe reliability issue in power grid networks of large integrated circuits (IC). The via array possesses special EM characteristics that have been observed to be distinct from a single via. In this study, a compact analytical model for the fast estimation of EM for via array was proposed by calculating the current distribution in the via arrays. The proposed model was then analyzed in a multi-layer power grid, which, for the first time, considered the impacts of the current propagation that exists in the vertical via array connected within the multi-level interconnection to improve the accuracy of the analytical model further. According to the model, a novel methodology for fullchip EM checking for multi-layered power grids was proposed. This method factored in the routing structure of the multi-layer power grid network, ensuring the EM assessment analysis's efficiency for large-scale power grid networks without sacrificing accuracy.

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Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid Networks

Jing

Cai

Zhou

2021

J. Comput. Sci. Technol.

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Incorporating the Role of Stress on Electromigration in Power Grids with Via Arrays

Cited by 7 publications

References 9 publications

Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects

Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects

A Power Grids Electromigration Analysis with Via Array Using Current-Tracing Model

Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid Networks

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