2017
DOI: 10.1364/oe.25.017562
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InAs/GaAs quantum dot infrared photodetector on a Si substrate by means of metal wafer bonding and epitaxial lift-off

Abstract: We report the fabrication of quantum dot infrared photodetectors (QDIPs) on silicon (Si) substrates by means of metal wafer bonding and an epitaxial lift-off process. According to the photoluminescence (PL) and x-ray diffraction measurements, the QDIP layer was transferred onto the Si substrate without degradation of the crystal quality or residual strain. In addition, from the PL results, we found that an optical cavity was formed because Pt/Au of the bonding material was served as the back mirror and the fac… Show more

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Cited by 26 publications
(9 citation statements)
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“…7(b) is J-V characteristics of the as-grown QDIP and B-QDIP of sample C. The J in forward bias region of the as-grown QDIP shows almost identical current with that in reverse bias region of B-QDIP and the same trend in the other regions, showing the decalcomania characteristics of two QDIPs. The identical dark current level suggests that the material characteristics of QDs and epitaxial layers were not changed after MWB and ELO, which is also previously described in our literature [18]. Fig.…”
Section: Resultssupporting
confidence: 87%
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“…7(b) is J-V characteristics of the as-grown QDIP and B-QDIP of sample C. The J in forward bias region of the as-grown QDIP shows almost identical current with that in reverse bias region of B-QDIP and the same trend in the other regions, showing the decalcomania characteristics of two QDIPs. The identical dark current level suggests that the material characteristics of QDs and epitaxial layers were not changed after MWB and ELO, which is also previously described in our literature [18]. Fig.…”
Section: Resultssupporting
confidence: 87%
“…In our previous study, QDIPs on a Si substrate were fabricated successfully by means of MWB and ELO technologies [18]. According to our studies, B-QDIP showed the change of photoluminescence (PL) characteristics as well as the change of the spectral response of the device.…”
Section: Introductionmentioning
confidence: 93%
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“…114 III−V semiconductors exhibit much higher efficiency and performance at infrared wavelengths. 114,115 Figure 3i shows the device structure schematic for a fiber-to-the-home transceiver array made by transferring premade III−V O-band photodetectors onto silicon photonic wafers. 116 With such a structure, a 10 Gbit/s transceiver array was demonstrated.…”
Section: Transistorsmentioning
confidence: 99%
“…Besides fundamental research, the monolithic integration of infrared photodetectors on silicon substrates [8,9] have also received wide attention from the application-oriented communities, due to the following advantages. First, larger area of III-V substrates (such as GaAs, GaSb and InP) are currently under development.…”
Section: Introductionmentioning
confidence: 99%