In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect

Hsu, Yu‐I; González, Mario; Bossuyt, Frederick; Axisa, Fabrice; Vanfleteren, Jan; Wolf, Ingrid De

doi:10.1557/jmr.2009.0447

Cited by 47 publications

(42 citation statements)

References 17 publications

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“…As boundary conditions, in accordance with the experiments reported in [6], a uniaxial strain of 60% is prescribed along the -axis. The geometry of the sample is defined by the following values: 0 = 60 ∘ , l Cu = 2 mm, w Cu = 0.1 mm, W S = 10 mm, and L S = 8 mm.…”

Section: The Zigzag Patterned Interconnectmentioning

confidence: 92%

“…In this section, the deformation behaviour of two typical interconnect structures will be evaluated: the zigzag structure, as proposed in [6], and the horseshoe shape [4,7]. As argued previously, the horseshoe shape offers high stretchabilities (strains up to 100% have been achieved without metal failure) combined with a rather low I/O density.…”

Section: Application To Two Characteristic Three-dimensional Structuresmentioning

confidence: 99%

“…The horseshoe shape offers high stretchability (strains up to 100% have been achieved without metal failure [7]) combined with a rather low I/O density. In contrast, the zigzag shape provides moderate stretchability (strains up to 60%) while a high I/O density can be achieved [6].…”

Section: Introductionmentioning

confidence: 99%

“…In general, stretchable electronics are composed of small rigid semiconductor islands interconnected by thin metal conductor lines, see Figure 1a. The stretchability of the thin interconnects can be realized by depositing serpentine-shaped interconnects [1] on compliant flat substrates using planar patterning technologies, of which an example is shown in Figure 1b [6].…”

Section: Introductionmentioning

confidence: 99%

“…Recently, horseshoe and zigzag interconnect patterns have been proposed as metal conductor designs [4,6] involving in-plane patterned copper conductors onto poly(dimethylsiloxane) (PDMS) rubber flat substrates. The horseshoe shape offers high stretchability (strains up to 100% have been achieved without metal failure [7]) combined with a rather low I/O density.…”

Section: Introductionmentioning

confidence: 99%

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Stretching-induced interconnect delamination in stretchable electronic circuits

Sluis¹,

Hsu²,

Timmermans³

et al. 2010

J. Phys. D: Appl. Phys.

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Abstract. Stretchable electronics offer increased design freedom of electronic products. Typically, small rigid semiconductor islands are interconnected with thin metal conductor lines on top of, or encapsulated in, a highly compliant substrate, such as a rubber material. A key requirement is large stretchability, i.e. the ability to withstand large deformations during usage without any loss of functionality. Stretching induced delamination is one of the major failure modes that determines the amount of stretchability that can be achieved for a given interconnect design. During peel testing, performed to characterize the interface behaviour, the rubber is severely lifted at the delamination front while at the same time fibrillation of the rubber at the peel front is observed by ESEM analyses. The interface properties are established by combining the results of numerical simulations and peeling experiments at two distinct scales: the global force-displacement curves and local rubber lift geometries. The thus quantified parameters are used to predict the delamination behaviour of zigzag and horseshoe patterned interconnect structures. The accuracy of these finite element simulations is assessed by a comparison of the calculated evolution of the shape of the interconnect structures and the fibrillation areas during stretching with experimental results obtained by detailed in-situ analyses.

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Section: The Zigzag Patterned Interconnectmentioning

confidence: 92%

Section: Application To Two Characteristic Three-dimensional Structuresmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Stretching-induced interconnect delamination in stretchable electronic circuits

Sluis¹,

Hsu²,

Timmermans³

et al. 2010

J. Phys. D: Appl. Phys.

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Experimental and Theoretical Studies of Serpentine Microstructures Bonded To Prestrained Elastomers for Stretchable Electronics

Zhang

Wang

et al. 2013

Adv Funct Materials

281

250

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Stretchable electronic devices that exploit inorganic materials are attractive due to their combination of high performance with mechanical deformability, particularly for applications in biomedical devices that require intimate integration with human body. Several mechanics and materials schemes have been devised for this type of technology, many of which exploit deformable interconnects. When such interconnects are fully bonded to the substrate and/or encapsulated in a solid material, useful but modest levels of deformation (<30–40%) are possible, with reversible and repeatable mechanics. Here, the use of prestrain in the substrate is introduced, together with interconnects in narrow, serpentine shapes, to yield significantly enhanced (more than two times) stretchability, to more than 100%. Fracture and cyclic fatigue testing on structures formed with and without prestrain quantitatively demonstrate the possible enhancements. Finite element analyses (FEA) illustrates the effects of various material and geometric parameters. A drastic decrease in the elastic stretchability is observed with increasing metal thickness, due to changes in the buckling mode, that is, from local wrinkling at small thicknesses to absence of such wrinkling at large thicknesses, as revealed by experiment. An analytic model quantitatively predicts the wavelength of this wrinkling, and explains the thickness dependence of the buckling behaviors.

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A Generic Soft Encapsulation Strategy for Stretchable Electronics

Zhu

et al. 2019

Adv Funct Materials

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Recent progress in stretchable forms of inorganic electronic systems has established a route to new classes of devices, with particularly unique capabilities in functional biointerfaces, because of their mechanical and geometrical compatibility with human tissues and organs. A reliable approach to physically and chemically protect the electronic components and interconnects is indispensable for practical applications. Although recent reports describe various options in soft, solid encapsulation, the development of approaches that do not significantly reduce the stretchability remains an area of continued focus. Herein, a generic, soft encapsulation strategy is reported, which is applicable to a wide range of stretchable interconnect designs, including those based on twodimensional (2D) serpentine configurations, 2D fractal-inspired patterns, and 3D helical configurations. This strategy forms the encapsulation while the system is in a prestrained state, in contrast to the traditional approach that involves the strain-free configuration. A systematic comparison reveals that substantial enhancements (e.g., ≈6.0 times for 2D serpentine, ≈4.0 times for 2D fractal, and ≈2.6 times for 3D helical) in the stretchability can be achieved through use of the proposed strategy. Demonstrated applications in highly stretchable lightemitting diodes systems that can be mounted onto complex curvilinear surfaces illustrate the general capabilities in functional device systems.

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In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect

Cited by 47 publications

References 17 publications

Stretching-induced interconnect delamination in stretchable electronic circuits

Stretching-induced interconnect delamination in stretchable electronic circuits

Experimental and Theoretical Studies of Serpentine Microstructures Bonded To Prestrained Elastomers for Stretchable Electronics

A Generic Soft Encapsulation Strategy for Stretchable Electronics

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