In-Situ Investigation of Lead-Free Solder Alloy Formation using a Hot-Plate Microscope

Bergmann, R.; Tang, Peter Torben; Hansen, Hans Nørgaard; Møller, Per

doi:10.1109/eptc.2007.4469822

Cited by 4 publications

(6 citation statements)

References 17 publications

(26 reference statements)

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“…The promising Au-Ge based candidate alloys that were determined based on the solidification criterion and optimized for a narrow solidification range by the CALPHAD approach, were precisely produced using a hot-plate microscope [14].…”

Section: Methodsmentioning

confidence: 99%

Development of Au–Ge based candidate alloys as an alternative to high-lead content solders

Chidambaram

Hald

Hattel

2010

Journal of Alloys and Compounds

113

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Section: Methodsmentioning

confidence: 99%

Development of Au–Ge based candidate alloys as an alternative to high-lead content solders

Chidambaram

Hald

Hattel

2010

Journal of Alloys and Compounds

113

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“…8 The essential part of the equipment is the specimen chamber in which a high vacuum (<1 × 10 -3 mbar) is created and is controlled by pressure measurements. Inside this chamber a molybdenum plate is mounted between the electrical contacts of the current heating system.…”

Section: Methodsmentioning

confidence: 99%

A corrosion investigation of solder candidates for high-temperature applications

Chidambaram

Hald

Ambat

et al. 2009

JOM

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How would you……describe the overall signifi cance of this paper? Potential lead-free solder candidates for high-temperature applications that were determined by using computational thermodynamics were assessed from the corrosion perspective. This work reveals that, among the two primary candidate alloys for high-temperature solders, Au-Sn-based candidate alloys close to the eutectic composition are more corrosion resistant than the Au-Gebased ones.…describe this work to a materials science and engineering professional with no experience in your technical specialty? The solder candidates that could adhere to the solidifi cation criterion required for replacing the high-leadcontaining solders were investigated from the corrosion perspective. An overview of corrosion-related problems that have to be thoroughly investigated before substituting the currently used one has been reported. …describe this work to a layperson?A drive for miniaturization, multiplicity of materials, and globalization has resulted in corrosion being a signifi cant issue in the complex electronic packaging systems that are being developed. The possible corrosion scenario for the promising lead-free solder candidates in such packaging for high-temperature applications has been investigated in this work.The step-soldering approach is being employed in the multi-chip module technology. High-lead-containing alloys are among the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work, a corrosion investigation was carried out on potential ternary lead-free candidate alloys based on these binary alloys for high-temperature applications. These promising ternary candidate alloys were determined by the CALPHAD approach based on the solidifi cation criterion and the nature of the phases predicted in the bulk solder. This work reveals that the Au-Sn-based candidate alloys close to the eutectic composition (20 wt.% Sn) are more corrosion resistant than the Au-Ge-based ones.

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“…Some reported data [9,10,17,18] are also collected in the table for comparison. As expected CC alloy exhibits the lowest hardness (HV138) and ICC alloy has the highest hardness (HV219) in the three tested samples.…”

Section: Microhardness At Room Temperaturementioning

confidence: 99%

“…Many studies of the AuSn20 solder are focusing on the soldering process, the microstructure evolution in the soldering joints [6,7], and the solder alloy's performance [8][9][10]. Considering the manufacturing of this alloy, some unsolved problems still remain, such as the microstructure evolution in the processing and the mechanical behavior of the bulk AuSn20 solder alloy.…”

Section: Introductionmentioning

confidence: 99%

“…They lead to difficulties in the manufacture of the AuSn20 solder strips or foils. In practice, the nonequilibrium solidification usually results in forming primary dendritic ζ-Au 5 Sn phase [6,10]. The length scale and morphology of the dendrites are very critical to the mechanical properties of the alloy, which are always adverse to the manufacturing process.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Evolution of primary phases and high-temperature compressive behaviors of as-cast AuSn20 alloys prepared by different solidification pathways

et al. 2011

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The as-cast AuSn20 eutectic alloys prepared by four different solidification pathways have been investigated in terms of the microstructure and the high-temperature compressive behaviors. The primary phases appeared in the four alloys are very sensitive to the cooling rate, which decrease in the size and the volume fraction as the cooling rate increases. The morphologies of the primary ζ′-Au 5 Sn phase are in dendritic at low cooling rate and change to rosette-like at high cooling rate. When the cooling rate is about 3.5× 10 4 K/min, the primary ζ′-Au 5 Sn can be suppressed but small δ-AuSn particles appear instead as the primary phase. The compressive behaviors at 220°C exhibit a low yielding stress and a long stress platform for the alloy prepared by injection casting with a copper crucible, which indicates an advantageous processing route for the production of the AuSn20 strips or foils.

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In-Situ Investigation of Lead-Free Solder Alloy Formation using a Hot-Plate Microscope

Cited by 4 publications

References 17 publications

Development of Au–Ge based candidate alloys as an alternative to high-lead content solders

Development of Au–Ge based candidate alloys as an alternative to high-lead content solders

A corrosion investigation of solder candidates for high-temperature applications

Evolution of primary phases and high-temperature compressive behaviors of as-cast AuSn20 alloys prepared by different solidification pathways

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