In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging

Khalilullah, Ibrahim; Reza, Talukder; Chen, Liangbiao; Mazumder, A. K. M. Monayem H.; Fan, Jiajie; Qian, Cheng; Zhang, Guoqi; Fan, Xuejun

doi:10.1109/eurosime.2017.7926275

Cited by 12 publications

(18 citation statements)

References 29 publications

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“…The swelling is reversible for both materials. In the previous study [27], a permanent swelling deformation was observed during the initial humidity ramp up phase. Such a phenomenon occurred in the present testing but it has been attributed to the instrument setup issue.…”

Section: Resultsmentioning

confidence: 79%

“…In this paper, a comprehensive study is conducted to investigate the effect of humidity and phosphor on moisture absorption, hygroscopic swelling, mechanical behavior, as well as thermal properties of silicone/phosphor composite in comparison with the pure silicone. Specifically, in situ hygroscopic swelling/de-swelling behavior is restudied for the repeatability and to confirm the non-existence of irreversible swelling observed in the previous study [27]. SEM/EDAX and FTIR were performed to identify the phosphor and silicone compositions.…”

Section: Introductionmentioning

confidence: 78%

“…According to the study of Wang et al [26], the introduction of phosphor powder into the silicone matrix shortens the cure rate, while ultraviolet radiation and temperature accelerate the cure of silicone/phosphor composite by increasing the rate of cross-linking. Khalilullah et al [27] tested the silicone/phosphor composite under high moisture condition and found irreversible swelling despite the reversibility of moisture absorption/desorption. Another study [28] revealed that addition of phosphor with a high temperature aging will stiffen the silicone matrix significantly.…”

Section: Introductionmentioning

confidence: 99%

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Effects of humidity and phosphor on silicone/phosphor composite in white light-emitting diode package

Hoque

Bradley

Fan

et al. 2019

J Mater Sci: Mater Electron

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Silicone/phosphor composite, which serve as mechanical protection and light conversion material, is an integral part of white light-emitting diode (LED) package. In this paper, a comprehensive study is conducted to investigate the effect of humidity and phosphor on moisture absorption, hygroscopic swelling, mechanical behavior, as well as thermal properties of silicone/ phosphor composite in comparison with the pure silicone. SEM/EDAX and FTIR were performed to identify the phosphor and silicone compositions. Through moisture sorption test, it has been observed that the addition of phosphor significantly lowers the capacity of moisture absorption, but accelerates the diffusivity of moisture absorption. The hygroscopic swelling test showed that the phosphor has little effect on the swelling compared to the pure silicone sample. Both moisture absorption/desorption and hygroscopic swelling/de-swelling are reversible. Strain ramp test revealed that the phosphor enhances the stiffness of the composite. The moisture absorption, however, has negligible impact on mechanical stiffness for both pure and composite samples. Finally, thermal expansion test showed that the coefficient of thermal expansion does not change with the addition of phosphor into pure silicone.

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Section: Resultsmentioning

confidence: 79%

Section: Introductionmentioning

confidence: 78%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Effects of humidity and phosphor on silicone/phosphor composite in white light-emitting diode package

Hoque

Bradley

Fan

et al. 2019

J Mater Sci: Mater Electron

Self Cite

View full text Add to dashboard Cite

show abstract

“…High-precision sensor is required in many of these applications during semiconductor packaging. In addition, the distortion stability and a high level of measurement is needed in MEMS sensors devices irrespective of external ecological circumstances [3,4]. In MEMS sensor devices, Epoxy Mold Compound (EMC) are being used as a major packaging material due to its high productivity, lower material as well as manufacturing cost and great effectiveness [5,6].…”

Section: Introductionmentioning

confidence: 99%

Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials

Kumari¹,

Singh²,

Singal³

2020

IJECE

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Today, Hygroscopic swelling is one of the biggest challenging problem of Epoxy mold compound (EMC) in packaging with Microelectromechanical system (MEMS) devices. To overcome this hygroscopic swelling problem of EMC and guard the devices, MEMS devices are molded in this paper with different Mold Compound (MC) i.e. titanium and ceramic etc. during their interconnection with the board. Also, a comparatively performance analysis of this various mold compound with MEMS pressure sensor has been studied in this paper at 60% humidity, 140 mol/m<sup>3</sup> saturation concentration and 25 <sup>o</sup>C. It was observed that hygroscopic swelling does not take place in the titanium mold compound. But, titanium is very costly so we have to consider something cheaper material i.e. ceramic in this paper. The Hygroscopic swelling in Ceramic Mold Compound after 1 year is nearly 0.05mm which is very less than epoxy.

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“…The curing process was investigated by the Differential Scanning Calorimetry (DSC) analysis, which showed that the addition of a siloxane-type copolymer into epoxy resin could increase the initial curing temperature and peak curing temperature. Khalilullah et al [11] found that the moisture could cause the irreversible swelling of phosphor/silicone composite due to its insufficient curing process. Wei et al [12,13] pointed out that it was possible to improve the curing effect by adjusting the curing conditions, such as increasing the temperature, ultraviolet illumination, etc.…”

Section: Introductionmentioning

confidence: 99%

High Moisture Accelerated Mechanical Behavior Degradation of Phosphor/Silicone Composites Used in White Light-Emitting Diodes

et al. 2019

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In a high-power white light emitting diode (LED) package, the phosphor/silicone composite is typically used for photometric and colorimetric conversions, ultimately producing the white light. However, the phosphor/silicone composite is always exposed under harsh environments with high temperature, high blue light irradiation and high moisture when the LED operates. Therefore, its reliability issue has become one of the critical bottlenecks to improve the lifetime of a high-power white LED package. As the curing process and mechanical behavior of phosphor/silicone composite essentially determine its reliability, this paper firstly uses an in situ viscosity monitoring approach combined with Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FTIR) analysis to explain the curing mechanism of a phosphor/silicone composite by taking the effects of temperature and phosphor mass fraction into consideration. Then, the mechanical properties of phosphor/silicone composites aged under a long-term high moisture condition are evaluated by using the tensile test. Meanwhile, the finite element (FE) simulations, the Mori–Tanaka theoretical estimations and the microstructure analysis are applied to investigate the high moisture induced degradation mechanisms. The results show that: (1) the in situ measured isothermal viscosity curves of both pristine silicone and phosphor/silicone composites follow the Arrhenius empirical model, and high temperature and high phosphor mass fraction can increase the curing rate; (2) the hydrosilylation reaction between silicones determines the curing mechanism of phosphor/silicone composite; (3) the tensile test, FE simulation and Mori–Tanaka theoretical prediction results confirm that the Young’s modulus of phosphor/silicone composite increases by gradually adding phosphors; and (4) the Young’s modulus of phosphor/silicone composite increases after the high moisture ageing test, which can be attributed to the oxidation and cross-linking reaction of silicone and the hydrolysis of phosphor powders.

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In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging

Cited by 12 publications

References 29 publications

Effects of humidity and phosphor on silicone/phosphor composite in white light-emitting diode package

Effects of humidity and phosphor on silicone/phosphor composite in white light-emitting diode package

Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials

High Moisture Accelerated Mechanical Behavior Degradation of Phosphor/Silicone Composites Used in White Light-Emitting Diodes

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