2010
DOI: 10.1016/j.microrel.2010.01.045
|View full text |Cite
|
Sign up to set email alerts
|

Improvement of TDDB reliability, characteristics of HfO2 high-k/metal gate MOSFET device with oxygen post deposition annealing

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2012
2012
2024
2024

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 13 publications
(1 citation statement)
references
References 11 publications
0
1
0
Order By: Relevance
“…It was suggested that the threshold voltage control has become one of the major concerns for the actual application of high-k gate dielectrics in CMOS devices [14][15][16][17][18]. The difficulty in threshold voltage control is due to the high fixed charge density in the high-k dielectric and the Fermi level pinning effect at the high-k/ metal interface [14].…”
Section: Resultsmentioning
confidence: 99%
“…It was suggested that the threshold voltage control has become one of the major concerns for the actual application of high-k gate dielectrics in CMOS devices [14][15][16][17][18]. The difficulty in threshold voltage control is due to the high fixed charge density in the high-k dielectric and the Fermi level pinning effect at the high-k/ metal interface [14].…”
Section: Resultsmentioning
confidence: 99%