Improvement of mechanical properties of Sn–58Bi alloy with multi-walled carbon nanotubes

Improved microstructure and mechanical properties for Sn58Bi solder alloy by addition of Ni-coated carbon nanotubes

“…The existence of Ni 3 Sn 4 plays an important role in preventing the growth of the reticular structure [11]. The other is that the dispersed CNTs can hinder grains growth [12,13]. Whereas, the size of the interphase spacing increases generally as the CNTs increases to 0.2 wt%, which can be seen from in Fig.…”

“…Many researchers devote their study to introducing CNTs as filler to make the Pb-free solder to be excellent. Peng and Gupta et al used CNTs as filler to strengthen SnBi and SnAgCu solder alloy [7,8].…”

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

“…They found that the doping of Sn-decorated MWCNT nanoparticles could improve the mechanical properties and the optimum addition was 0.1 wt% [61] and the 15 Journal of Nanomaterials fracture energy and shear strength increased by 80% and 16%, respectively, when the addition of Ag-MWCNTs was 0.05 wt% [35]. He et al [108] demonstrated that the bending strength of Sn-58Bi-0.03CNTs composite solder increased by 10.5% compared with the plain Sn-58Bi solder. Additionally, the toughness of Sn-58Bi-0.03CNTs composite solder increased by 48.9% than that of plain solder.…”

Properties and Microstructures of Sn-Bi-X Lead-Free Solders

“…When content of graphite was at 0.14 wt.%, the average ultimate tensile strength of the composite solder was lowest, namely, 52.5 MPa. However, the elongation of Sn-Bi with 0.07 wt.% nanosized graphite was highest up to 2.019 m. He et al [68] 6 Advances in Materials Science and Engineering found that the UTS of the Sn-58Bi composite solder with 0.03%, 0.06%, and 0.1% CNTs was higher than that of the Sn-58Bi solder, but the UTS was decreased with the addition of CNTs increased. The UTS of the Sn-58Bi-0.03CNTs was the highest which reached 94.24 MPa.…”