Improved microstructure and mechanical properties for Sn58Bi solder alloy by addition of Ni-coated carbon nanotubes

Yang, Lin; Zhou, Wei; Liang, Yinghua; Cui, Wenquan; Wu, Peng

doi:10.1016/j.msea.2015.06.080

Cited by 57 publications

(22 citation statements)

References 34 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

“…Sn-Bi composite solders containing Ni-CNTs were successfully synthesized [43]. The mechanical properties of Sn-Bi with different weight percentages of Ni-CNT were investigated [43].…”

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

“…The mechanical properties of Sn-Bi with different weight percentages of Ni-CNT were investigated [43].…”

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

“…The UTS and elongation of the Sn-Bi-0.05(Ni-CNT) solder with the optimized amount (0.05 wt.%) of Ni-CNTs increased remarkably because the CNTs and Ni 3 Sn 4 enhanced the wettability and bondability of the composite solder [43]. However, because of the presence of CNT clusters and the intrinsic brittleness of IMCs, the UTS and elongation degraded with increased addition of Ni-CNTs [43].…”

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

“…However, because of the presence of CNT clusters and the intrinsic brittleness of IMCs, the UTS and elongation degraded with increased addition of Ni-CNTs [43]. That is to say, the UTS of the solder joint reached its maximum value with 0.05 wt.% Ni-CNTs addition and then degraded after increased addition of Ni-CNT [43]. Moreover, the tensile strength of the composite solder was much higher than that of the pristine solder, and subsequently, the creep resistance and hardness of the Sn-Bi-0.05(Ni-CNT) solder increased significantly compared to those of the Sn-Bi solder [43].…”

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

See 4 more Smart Citations

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

View full text Add to dashboard Cite

The increasing application of heat-sensitive microelectronic components such as a multitude of transistors, polymer-based microchips, and so on, and flexible polymer substrates including polyethylene terephthalate (PET) and polyimide (PI), among others, for use in wearable devices has led to the development of more advanced, low melting temperature solders (<150°C) for interconnecting components in various applications. However, the current low melting temperature solders face several key challenges, which include more intermetallic compound formation (thus become more brittle), cost issues according to the addition of supplementary elements to decrease the melting point temperature, an increase in the possibility of thermal or popcorn cracking (reliability problems), and so on. Furthermore, the low melting temperature solders are still required to possess rapid electronic/electrical transport ability (high electrical conductivity and current density) and accompany strong mechanical strength sustaining the heavy-uploaded microelectronic devices on the plastic substrates, which are at least those of the conventional melting temperature solders (180-230°C). Thus, the pursuit of more advanced low melting temperature solders for interconnections is timely. This review is devoted to the research on three methods to improve the current properties (i.e., electrical and thermomechanical properties) of low melting temperature solders: (i) doping with a small amount of certain additives, (ii) alloying with a large amount of certain additives, and (iii) reinforcing with metal, carbon, or ceramic materials. In this review, we also summarize the overall recent progress in low melting temperature solders and present a critical overview of the basis of microscopic analysis with regard to grain size and solid solutions, electrical conductivity by supplementation with conductive additives, thermal behavior (melting point and melting range) according to surface oxidation and intermetallic compound formation, and various mechanical properties.

show abstract

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

“…Sn-Bi composite solders containing Ni-CNTs were successfully synthesized [43]. The mechanical properties of Sn-Bi with different weight percentages of Ni-CNT were investigated [43].…”

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

“…The mechanical properties of Sn-Bi with different weight percentages of Ni-CNT were investigated [43].…”

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 99%