Improvement of Bondability by Addition of Carboxylic Acid to the Sinter-Bonding Paste Containing Bimodal-Sized Cu Particles and Rapid Bonding in Air

Namgoong, Doyeop; Siow, Kim Shyong; Lee, Jong‐Hyun

doi:10.1007/s12540-022-01224-6

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Improvement of Bondability by Addition of Carboxylic Acid to the Sinter-Bonding Paste Containing Bimodal-Sized Cu Particles and Rapid Bonding in Air

Cited by 8 publications

References 33 publications

Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding

Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding

Ultrafast Sinter Bonding Between Cu Finishes Under Moderate Compression Using In Situ Derived Ag Formed via Low-Temperature Decomposition of Ag2O in the Bonding Paste

Low-temperature copper sinter-joining technology for power electronics packaging: A review

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