Low-temperature copper sinter-joining technology for power electronics packaging: A review

Wang, Yujian; Xu, Dou; Yan, Haidong; Li, Cai-Fu; Chen, Chuantong; Li, Wanli

doi:10.1016/j.jmatprotec.2024.118526

Journal of Materials Processing Technology

2024

DOI: 10.1016/j.jmatprotec.2024.118526

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Low-temperature copper sinter-joining technology for power electronics packaging: A review

Yujian Wang,

Dou Xu,

Haidong Yan

et al.

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Low-temperature copper sinter-joining technology for power electronics packaging: A review

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References 124 publications

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