2019
DOI: 10.1109/led.2019.2934145
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Improved Resistive Switching Uniformity of SiO2 Electrolyte-Based Resistive Random Access Memory Device With Cu Oxidizable Electrode

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Cited by 29 publications
(18 citation statements)
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“…Figure d–f shows the statistical distributions of the set voltage ( V set ) and reset voltage ( V reset ) for the Al and Ag electrode device cycles. It can be noted that the dispersion of V set and V reset of the ITO/polymer/Al devices was narrower and the coefficient of variation was lower than Ag electrode samples. Overall, the resistance switching characteristics of the Al electrode devices were improved compared with that of Ag electrode devices. As a result, the Al electrode exhibited better electrical storage characteristics.…”
Section: Resultsmentioning
confidence: 93%
“…Figure d–f shows the statistical distributions of the set voltage ( V set ) and reset voltage ( V reset ) for the Al and Ag electrode device cycles. It can be noted that the dispersion of V set and V reset of the ITO/polymer/Al devices was narrower and the coefficient of variation was lower than Ag electrode samples. Overall, the resistance switching characteristics of the Al electrode devices were improved compared with that of Ag electrode devices. As a result, the Al electrode exhibited better electrical storage characteristics.…”
Section: Resultsmentioning
confidence: 93%
“…Although the impact of Ag active TE on SiO 2 -CBRAMs has been studied by other groups [ 62 , 63 ], the main contribution of the present work is the demonstration of a relatively sharp transition slope, low V SET voltage and huge memory window. Moreover, we have to underline the completely forming-free nature of the proposed memory concept that is always beneficial in terms of periphery circuit design.…”
Section: Discussionmentioning
confidence: 95%
“…From the microscopic point of view, the stochasticity in the formation of the CF induces the nonuniformity in . In this regard, many efforts have been made to reduce this nonuniformity: Li et al showed that utilizing copper ions over silver ions improves the uniformity in CB-RAM because of the faster diffusion of the former 18 , whereas Kim et al used a cone-shaped Cu-ion source in CB-RAM 19 . Niu et al engineered field crowding using a narrow bottom electrode, whose edge forms a field-crowding location and in turn a CF growth site, to improve the stability of a HfO 2 ReRAM 20 .…”
Section: Resultsmentioning
confidence: 99%
“…Therefore, it is very important to study this nonuniformity during switching and determine solutions to reduce it. In this regard, many efforts have been expended to improve the switching uniformity [18][19][20][21][22][23][24] .…”
mentioning
confidence: 99%