Improved Reliability of Power Modules: A Review of Online Junction Temperature Measurement Methods

Online Junction Temperature Estimation of SiC Power <sc>mosfets</sc> Through On-State Voltage Mapping

“…Despite the efforts of the scientific community and power module manufacturers, the measurement of the junction temperature of power semiconductor devices is still a challenge. Over the years the problem has become more important due to the further increased power density of the new devices such as Silicon Carbide (SiC) power MOSFETs [1], [2] and [3].…”

Thermal Analysis and Balancing for Modular Multilevel Converters in HVDC Applications

“…Despite the high importance of the junction temperature, there is still no suitable low cost method for accessing the junction temperature of the power semiconductors: Direct measurement is only practical in laboratory environments, Thermo Sensitive Electrical Parameters (TSEP) affect additional components and sensor costs and observers or estimators deal with parameter uncertainties and high complexity for high precision [35]. Particularly, in modular power converters, there is the additional challenge of a high number of power semiconductors, resulting in many junction temperatures to be taken into account.…”

On-state voltage drop based power limit detection of IGBT inverters

“…Because of a spatial distribution and power module packaging constraints, a direct measurement of temperature is not practical [10]. Hence, several methods are proposed using dynamic and static characteristics of power modules [11]. However, until today, few methods are discussing to make them applicable directly into a converter operation without any modification in a converter structure and control [12], [3].…”