Impact of Use Conditions on Dielectric and Conductor Material Models for High-Speed Package Interconnects

Geyik, Cemil S.; Mekonnen, Yidnekachew S.; Zhang, Zhichao; Aygün, Kemal

doi:10.1109/tcpmt.2019.2926355

Cited by 16 publications

(1 citation statement)

References 22 publications

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“…Ideally, devices, component, and interconnects should maintain stable performance under various signal, power, and thermomechanical loads. As discussed in [29], [30], the packaging structure affects not only the signal and power distribution but also the electrical performance of each component or device. This demands accurate and reliable multi-physics modeling and analyses from the electrical, materials, chemical and mechanical standpoints.…”

Section: Multi-physics Analysis and Modelingmentioning

confidence: 99%

A Review of 5G Front-End Systems Package Integration

Watanabe

Ali

Sayeed

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

142

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Increasing data rates, spectrum efficiency and energy efficiency have been driving major advances in the design and hardware integration of RF communication networks. In order to meet the data rate and efficiency metrics, 5G networks have emerged as a follow-on to 4G, and projected to have 100X higher wireless date rates and 100X lower latency than those with current 4G networks. Major challenges arise in the packaging of radio-frequency front-end modules because of the stringent low signal-loss requirements in the millimeter-wave frequency bands, and precision-impedance designs with smaller footprints and thickness. Heterogeneous integration in 3D ultra-thin packages with higher component densities and performance than with the existing 2D packages is needed to realize such 5G systems. This paper reviews the key building blocks of 5G systems and the underlying advances in packaging technologies to realize them.

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Section: Multi-physics Analysis and Modelingmentioning

confidence: 99%

A Review of 5G Front-End Systems Package Integration

Watanabe

Ali

Sayeed

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

142

View full text Add to dashboard Cite

show abstract

5G Technology Components and Material Solutions for Hardware System Integration

Tong¹

2022

Advanced Materials and Components for 5G and Beyond

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High-density low-loss millimeter-wave package interconnects with the impact of dielectric-material surface roughness

Watanabe

Kanno

Ito

et al. 2021

Applied Physics Letters

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Heterogeneous package integration and chiplet approaches are the key technology to enable next-generation high performance small form-factor packages for emerging applications. Millimeter-wave packaging for fifth-generation and upcoming sixth-generation platforms also need to meet the high-density low signal-loss interconnect specifications utilizing advanced conductor and dielectric materials. This article presents the comparison of the liquid-based photoimageable dielectric (PID) and dry-film dielectric materials in terms of interconnect path losses that are critical in mm-wave frequency bands. The conductor loss being more dominant in the frequency bands and in thinner dielectric structures, we assess daisy chains and microstrip lines on 15-μm dielectric by measuring the S-parameters to quantify the impact of the surface roughness at around 28 GHz. Measured results from the daisy chain and microstrip line structures exhibit that the smooth surface of the liquid-based PID (3 nm) leads to 8%–32% lower signal loss in the dB scale than the 325-nm rough dry-film dielectric. The study provides comprehensive experimental results that the different material forms with various surface roughness largely impact the package-level interconnect loss.

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Impact of Use Conditions on Dielectric and Conductor Material Models for High-Speed Package Interconnects

Cited by 16 publications

References 22 publications

A Review of 5G Front-End Systems Package Integration

A Review of 5G Front-End Systems Package Integration

5G Technology Components and Material Solutions for Hardware System Integration

High-density low-loss millimeter-wave package interconnects with the impact of dielectric-material surface roughness

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