High-density low-loss millimeter-wave package interconnects with the impact of dielectric-material surface roughness

Watanabe, Atom O.; Kanno, Kimiyuki; Ito, Hirokazu; Tummala, Rao; Swaminathan, Madhavan

doi:10.1063/5.0055637

Cited by 10 publications

(2 citation statements)

References 20 publications

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“…The surface roughness will further increase the conductor loss as compared to the current study (without considering the surface roughness), which will exhibit a more dominant role of the conductor loss towards the insertion loss degradation. Note that the quantitative impact of the surface roughness on the insertion loss and other aspects of performance is a debatable topic, with a host of different models and experiments available in the literature [18][19][20][21][22], to which the interested readers can refer in order to explore this further.…”

Section: Discussionmentioning

confidence: 99%

Rethinking Liquid Crystal Tunable Phase Shifter Design with Inverted Microstrip Lines at 1–67 GHz by Dissipative Loss Analysis

2023

Electronics

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Growing 5G/6G phased-array beam-steering applications, for which liquid crystal (LC) is one of the enabling technology candidates, have sparked interest in the modulation of the phase (and amplitude) of microwave and millimeter-wave signals. In this communication, fresh insights into the systematic design analysis of a 1–67 GHz passive inverted microstrip line (IMSL) phase shifter filled with highly anisotropic LC as tunable dielectric media are obtained. Based on waveguide disturbance tests to characterize the dielectric properties of the non-tunable PCB and tunable LC used in the IMSL phase shift device filled with a GT3-24002 LC layer (125 µm thick) partially enclosing a 220 µm wide, 17 µm thick, 1.35 cm long copper core line, a 0–π differential phase shift in the 1–67 GHz range with less than 2 dB insertion loss is reported. Dissipative loss analysis shows that the dielectric absorption of the LC is 21.28% of the input signal power at 60 GHz. Further investigation is performed to quantify the impacts of dielectric substrate thicknesses (PCB and LC) on the wave-occupied volume ratio (and hence the phase tuning range), as well as on dissipative losses (including conductor loss and dielectric loss). Specifically, conductor loss is observed to follow a linear relationship with the reciprocal of the LC thickness.

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Section: Discussionmentioning

confidence: 99%

Rethinking Liquid Crystal Tunable Phase Shifter Design with Inverted Microstrip Lines at 1–67 GHz by Dissipative Loss Analysis

2023

Electronics

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“…7(f)) which land from the thin build-up layers directly onto the chip pads [85], [86], [19], [81], [88]. Via-in-via through package interconnects [26], [80], [81] and microviaenhanced organic RDLs on glass core substrates [114], [115], [116] were also reported for future HPC and wireless communications systems.…”

Section: Components a Transmssion Lines And Interconnectsmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).

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Investigation of novel leveler Rhodamine B on copper superconformal electrodeposition of microvias by theoretical and experimental studies

Ren

Zhang

et al. 2023

Applied Surface Science

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High-density low-loss millimeter-wave package interconnects with the impact of dielectric-material surface roughness

Cited by 10 publications

References 20 publications

Rethinking Liquid Crystal Tunable Phase Shifter Design with Inverted Microstrip Lines at 1–67 GHz by Dissipative Loss Analysis

Rethinking Liquid Crystal Tunable Phase Shifter Design with Inverted Microstrip Lines at 1–67 GHz by Dissipative Loss Analysis

RF Glass Technology Is Going Mainstream: Review and Future Applications

Investigation of novel leveler Rhodamine B on copper superconformal electrodeposition of microvias by theoretical and experimental studies

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