Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions

Syed, Ahmer; Scanlan, James P.; Cha, Se Woong; Kang, Won Joon; Sohn, Eun Sook; Kim, Tae Seong; Ryu, Chang Gyun

doi:10.1109/ectc.2008.4550168

Cited by 24 publications

(14 citation statements)

References 4 publications

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“…Ahmer Syed and his collaborators at Amkor [57] presented a collection of test data comparing the effects of package design and solder materials under thermal cycling, drop, and cyclic bend performed on 0.4-mm-pitch area array packages. Test results indicate that lower silver content solder balls (SAC105 and SAC125Ni) performed better under drop conditions compared to high silver content (SAC305 and Sn3.5Ag), while temperature cycling reliability suffers as silver content decreases.…”

Section: Discussionmentioning

confidence: 99%

Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies

Ghaffarian

2011

Structural Dynamics of Electronic and Photonic Systems

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SUMMARYCommercial off-the-shelf area array packaging (COTS AAP) technologies are considered for use in a number of high-reliability electronics systems. Understanding the process and quality assurance (QA) indicators for reliability, as well as developing methods to project life under thermal and mechanical environment, is important for the low-risk insertion of these newly available electronic packages. Extensive investigations were performed by NASA in collaboration with industry and universities to address key manufacturing and reliability issues on the continuously evolving AAP technology. The reliability results based on test data will facilitate use of various low-pitch and high-input/output (I/O) area array packages, with more processing power in a smaller board footprint. Topics discussed in this chapter are as follows:• Packaging technology trend for AAPs, including plastic ball grid array (PBGA), chipscale packages (CSPs), and 3D stack packages. • Summary of key parameters that affect assembly reliability of PBGAs and flip-chip BGA (FCBGA) based on a comprehensive literature search. The effect of a doublesided mirror image array package on solder joint reliability is also addressed. IPC 9701A specification was reviewed for lead-free solder alloy requirements. • Test results for a test vehicle having various packages including a PBGA with 1156 I/Os subjected to various thermal cycling. X-ray and scanning electron microscopy (SEM) and X-sections after thermal cycling. • Literature survey and test results for a COTS PBGA 676 I/O package assembly with various ball/solder alloys representing the current migration of industry to lead-free solders. A number of test vehicles, assembled and supplied by an engineering manufacturing service (EMS) company collaborator, were subjected to thermal cycling evaluation as part of collaboration activity. The test results are presented. • The test results for thermal cycling and vibration of numerous CSPs soldered with tin-lead and with and without underfill are presented. • Extensive vibration and thermal cycle data were generated by the consortium team members of the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP). Vibration test results for BGA 225 I/O package assemblies with tin-lead and lead-free solder were reviewed and compared with other models and 519

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Section: Discussionmentioning

confidence: 99%

Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies

Ghaffarian

2011

Structural Dynamics of Electronic and Photonic Systems

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“…Moreover, decreasing Ag content also reduces the cost of raw materials. However, this improvement in drop impact performance can occur with a worsening of temperature cycling reliability (Kittidacha et al, 2008;Syed et al, 2008;Shnawah et al, 2012a, b (Pandher and Healey, 2003;Liu et al, 2009;Yu et al, 2010;Shnawah et al, 2012a, b). The net result of a minor alloying addition is to:…”

Section: Introductionmentioning

confidence: 93%

The bulk alloy microstructure and tensile properties of Sn‐1Ag‐0.5Cu‐xAl lead‐free solder alloys (x=0, 1, 1.5 and 2 wt.%)

Shnawah

Sabri

Badruddin

et al. 2012

Microelectronics International

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Purpose -The purpose of this paper is to investigate the effect of Al addition on the bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu (SAC105) solder alloy. Design/methodology/approach -The Sn-1Ag-0.5Cu-xAl (x ¼ 0, 1, 1.5 and 2 wt.%) bulk solder specimens with flat dog-bone shape were used for tensile testing in this work. The specimens were prepared by melting purity ingots of Sn, Ag, Cu and Al in an induction furnace. Subsequently, the molten alloys were poured into pre-heated stainless steel molds, and the molds were naturally air-cooled to room temperature. Finally, the molds were disassembled, and the dog-bone samples were removed. The solder specimens were subjected to tensile testing on an INSTRON tester with loading rate 10 2 3 s 2 1 . The microstructural analysis was carried out using scanning electron microscopy/Energy dispersive X-ray spectroscopy. Electron Backscatter Diffraction (EBSD) analysis was used to identify the IMC phases. To obtain the microstructure, the solder samples were prepared by dicing, molding, grinding and polishing processes.Findings -The addition of Al to the SAC105 solder alloy suppresses the formation of Ag 3 Sn and Cu 6 Sn 5 IMC particles and leads to the formation of larger Al-rich and Al-Cu IMC particles and a large amount of fine Al-Ag IMC particles. The addition of Al also leads to refining of the primary b-Sn grains. The addition of Al results in a significant increase on the elastic modulus and yield strength. On the other hand, the addition of Al drastically deteriorates the total elongation. Originality/value -The addition of Al to the low Ag-content SAC105 solder alloy has been discussed for the first time. This work provides a starting-point to study the effect of Al addition on the drop impact and thermal cycling reliability of the SAC105 alloy.

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“…As a solder joint material, the low Ag-content SAC105 solder alloy has been reported to have good drop impact reliability [16,31]. This alloy possess low elastic modulus and yield strength and large elongation, which in turn improve the bulk compliance and plastic energy dissipation ability of the solder joints.…”

Section: Tensile Testmentioning

confidence: 98%