Novel Fe-containing Sn–1Ag–0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products

Shnawah, Dhafer Abdulameer; Said, Suhana Mohd; Sabri, Mohd Faizul Mohd; Badruddin, Irfan Anjum; Xing, Fa

doi:10.1016/j.microrel.2012.03.028

Cited by 40 publications

(8 citation statements)

References 35 publications

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“…This corresponds to an increased interest in the development of Sn-Ag-Cu alloy containing a fourth alloying element. The use conditions of the Sn-1.0Ag-0.5Cu (SAC105) bearing Fe have been shown to be consistent with the conditions for conventional SAC105 solder alloys [6]. This is due to the findings that small additions of Fe may increase the elastic compliance and plastic energy dissipation ability of the solder.…”

Section: Introductionmentioning

confidence: 60%

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Microstructure of Sn–1Ag–0.5Cu solder alloy bearing Fe under salt spray test

Nordin

Said

Ramli

et al. 2014

Microelectronics Reliability

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Section: Introductionmentioning

confidence: 60%

“…This is due to the findings that small additions of Fe may increase the elastic compliance and plastic energy dissipation ability of the solder. This specific improvement is believed to be a significant factor in better drop impact performance of the solder alloy [6,7].…”

Section: Introductionmentioning

confidence: 98%

Microstructure of Sn–1Ag–0.5Cu solder alloy bearing Fe under salt spray test

Nordin

Said

Ramli

et al. 2014

Microelectronics Reliability

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“…The Ag 3 Sn, Cu 6 Sn 5 , SbSn, and AlCu IMCs have been sufficiently recognized to typically possess much more superior strength (YS and UTS) than the bulk materials in SnAgCu alloy. However, the b-Sn distinct phase properly has the lowest yield strength and lowest elastic modulus among the bulk essential IMCs of SnAgCu alloy [43]. It has been recognized that the alloy that possesses low tensile parameters and large ductility improves the bulk compliance and plastic energy dissipation capability of the solder joint.…”

Section: Tensile Testsmentioning

confidence: 99%

Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field

El-Taher

Azeem

Ibrahiem

2021

J Mater Sci: Mater Electron

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The main scope of this research is to investigate the impact of rotating magnetic field (RMF) on the physical properties of the Sn-0.5Ag-0.5Cu-2.0Sb-0.1Al (SAC0505SbAl) solder alloy. The application of RMF during molten alloy cooling showed prominent effect on the morphology, thermal properties, and the consequent mechanical characteristics. It was shown that the dendritic morphology was changed from columnar dendrites to equiaxed grains with the application of RMF. In addition, RMF processing modified the eutectic phases in the alloy matrix. These notable modifications have resulted in a substantial increase in ductility (* 30%) with a slight decrease in tensile parameters (UTS and YS). Such effects could enhance elastic compliance and plastic energy dissipation ability of solder alloys, which plays superbly fundamental function in drop-impact reliability. Differential scanning calorimetry (DSC) analysis reveals that significant decrease in pasty range (from 10.8 to 7.5°C) and undercooling (from 13.1 to 9.0°C) was attained after applying RMF. The stress exponent (n), the activation energy (Q), and deformation mechanism of the SAC0505SbAl alloy processed with and without RMF were discussed in detail. The obtained results are certainly expected to fill the knowledge gap about the behavior of these recently developed solder alloys under the effect of RMF that are potential alternatives as Pb-free interconnecting material in microelectronic packaging industry.

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“…Therefore, it is necessary to explore the Sn-Ag-Cu leadfree solder with low-Ag content. However, with the reduction of Ag content, the properties such as wetting behavior and thermal fatigue performance become worse [2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Effect of Ga on the Inoxidizability and Wettability of Sn-0.5Ag-0.7Cu-0.05Pr Solder

Xue

Luo

et al. 2017

Advances in Materials Science and Engineering

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The effect of trace amount of Ga on the inoxidizability and wettability of Sn-0.5Ag-0.7Cu-0.05Pr solders was investigated systematically by means of microstructure characterizations. The results indicate that the wettability and oxidation resistance properties are remarkably improved with addition of trace amount of Ga. Moreover, it is observed that the trace amount of Ga in Sn-0.5Ag-0.7Cu-0.05Pr solders refines the matrix microstructure. The relationship between wettability and oxidation resistance was put into deep study. And Ga was found to be enriched on the surface of the molten solder, which benefited the properties correspondingly. The results of this study can stimulate the use of low-silver Sn-Ag-Cu-Pr solders for various applications.

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Novel Fe-containing Sn–1Ag–0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products

Cited by 40 publications

References 35 publications

Microstructure of Sn–1Ag–0.5Cu solder alloy bearing Fe under salt spray test

Microstructure of Sn–1Ag–0.5Cu solder alloy bearing Fe under salt spray test

Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field

Effect of Ga on the Inoxidizability and Wettability of Sn-0.5Ag-0.7Cu-0.05Pr Solder

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