Impact of materials on back-contact module reliability

Guichoux, M.; Tjengdrawira, C.; Veldman, Dirk; Jong, P.C. de

doi:10.1109/pvsc.2010.5615877

Cited by 2 publications

(3 citation statements)

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“…The introduction of a new module technology based on a back-sheet foil with an integrated conductive grid in combination with conductive adhesive raises issues in terms of the reliability of the concept. Recent studies carried out on small-size (single and four cells) and full-size (6×10 cells) modules pointed at a prominent impact of dimensional and functional stability of the conductive back-sheet foil on the module reliability [5,6]. Guichoux et al [5] pointed at an interaction between encapsulant and ILD in the presence of moisture causing delamination and ultimately module failure.…”

Section: Introductionmentioning

confidence: 99%

“…Recent studies carried out on small-size (single and four cells) and full-size (6×10 cells) modules pointed at a prominent impact of dimensional and functional stability of the conductive back-sheet foil on the module reliability [5,6]. Guichoux et al [5] pointed at an interaction between encapsulant and ILD in the presence of moisture causing delamination and ultimately module failure. Eerenstein et al [6] have reported on MWT modules successfully passing TC300, DH2000, and the wet leakage test.…”

Section: Introductionmentioning

confidence: 99%

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Systematic reliability studies of back-contact photovoltaic modules

2012

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Back-contact module technology offers the advantage of lower yield loss, higher power conversion efficiency, and significantly faster manufacturing as compared to conventional H-pattern modules. In this paper we present results of a systematic accelerated ageing study of ECN back-contact metallization wrap through (MWT) modules. A series of fullsize (6×10 cells) MWT modules based on combinations of four different conductive back-sheet foils, two encapsulants, and two electrically conductive adhesives were manufactured and subjected to the damp heat conditions as defined in the IEC61215 edition 2 standard. Modules that combine conductive back-sheet foil with certain types of isolation lacquer (also referred to as inner layer dielectric, ILD) and EVA showed a high failure rate. It appears that a combined effect of moisture and EVA causes a weakening of adhesion strength at Cu/ILD interface and decisively contributes to delamination at Cu/ILD interface. This delamination puts stress on the interconnection and ultimately results in interconnection failure. Removal of ILD significantly improves the stability of MWT modules in damp heat, as up to 2000 hrs of testing only up to 2.4% relative power loss was observed, and also lowers the foil cost.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Systematic reliability studies of back-contact photovoltaic modules

2012

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“…It was reported that epoxy-based conductive adhesive is applied in back contact solar cell module technology which especially features with its low shading coverage on the cell surface and an optimization of electrical design by minimizing the string/encapsulation loss [10][11][12]. The conductive adhesive has a low curing temperature which beneficially reduces cell breakage during interconnecting, and the literature reveals the back contact solar module pass the thermal cycling for 200 times [13]. However, the low acceptance in the replacement of conductive adhesive in solar cell stringing is restricted to the lack of confidence in the reliability and unfamiliarity.…”

Section: Introductionmentioning

confidence: 99%

An innovative packaging process for low power loss solar modules

Hsieh

Chang

Hsi

et al. 2013

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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This paper presents an innovative interconnecting process for the 5 inch × 5 inch photovoltaic (PV) modules based on single crystalline silicon solar cells using epoxy-based conductive adhesive (CA), and a conventional soldering type solar cell is also performed for comparison. The electrical performance of solar modules with innovative interconnecting process (Inno 1, 2, and 3) was characterized by a flasher system in AAA class, and the long-term durability of the solar modules was verified by thermal cycling test in accordance with IEC 61215 standard. The result shows that the power loss for innovative stringing solar cell with epoxy-based CA exhibits a two-stage degradation mechanism, in which a higher lossrate occurs before TC 600 times. For Sn-Pb solder solar module, a linear degradation is observed during the 1600 thermal cycling test, suggesting a single degradation mechanism. Compare the power loss of the solar modules, the innovative modules are around 4.31% to 5.21%, while a high power loss of 7.49% is obtained in soldering type module after 1600 TC test.According to the cross-sectional images focusing on the solder joints, a better performance of the epoxy-based CA solar module was due to the good adherence and stability of the soldering interfaces between the cell metallization and the interconnecting element. Electroluminescence (EL) detection was applied to identify the defects and high series resistance area which may degrade the power of the cell. Some dark failure area on the central region after 1600 thermal cycling test (TCT) is shown in soldering type sample. And a high contrast of the emission intensity is obtained, which implies a mismatch of minor carrier diffusion length in the solar cell. The dark regions observed in the soldering type sample indicated that a higher Rs was generated in the module. On the other hand, CA sample showed a clear image on the cell itself and the p-n junction borderline area.

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Impact of materials on back-contact module reliability

Cited by 2 publications

References 4 publications

Systematic reliability studies of back-contact photovoltaic modules

Systematic reliability studies of back-contact photovoltaic modules

An innovative packaging process for low power loss solar modules

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