2022
DOI: 10.1016/j.jmrt.2022.09.048
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Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components

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Cited by 10 publications
(1 citation statement)
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“…The local deterioration of heat removal from the contact can lead to its overheating, the occurrence of thermal stresses and, ultimately, to the destruction of the joint. D. Straubinger et al [ 13 ] demonstrated the reduction of shear strength in solder joints under current loading and isothermal aging. The formation of voids in the solder layer during the flow of current can also lead to the appearance and increase in the joint TR [ 14 ].…”
Section: Introductionmentioning
confidence: 99%
“…The local deterioration of heat removal from the contact can lead to its overheating, the occurrence of thermal stresses and, ultimately, to the destruction of the joint. D. Straubinger et al [ 13 ] demonstrated the reduction of shear strength in solder joints under current loading and isothermal aging. The formation of voids in the solder layer during the flow of current can also lead to the appearance and increase in the joint TR [ 14 ].…”
Section: Introductionmentioning
confidence: 99%