Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration

Bashir, M. Nasir; Khan, Niaz Bahadur; Bashir, Shahid; Khan, Abdul Faheem; Quazi, M. M.; Gul, M.; Wakeel, Saif; Saad, Hafiz Muhammad

doi:10.1007/s10854-022-09722-4

Cited by 2 publications

(1 citation statement)

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“…As the current development of electronic products favors miniaturization and integration, the scale of micro-solder joints is becoming smaller, resulting in an increase in the current density carried by the solder joints [10][11][12]. At high current densities, solder joints generate not only electromigration [13,14] but also a large amount of Joule heat [15,16], which seriously affects the reliability of solder joints and has become one of the most important areas in current research [17][18][19].…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

Gao

Zhang

et al. 2023

Metals

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Electromigration is one of the most important research issues affecting the reliability of solder joints. Current-induced Joule heating affects the electromigration behavior of solder joints. Solder joints with different cross-sectional areas were designed to obtain different Joule heating properties. The effects of the interfacial intermetallic compound (IMC) and mechanical properties of Sn58Bi/Cu solder joints were studied for different Joule heating properties. The results showed that as the cross-sectional area of the Sn58Bi/Cu solder joints increased, the Joule heating of the joint increased. The anode IMC thickness of the joint thickened and transformed into a planar shape. The Bi migrated to the anode region to form a Bi-rich layer and gradually increased in thickness. The cathode IMC thickness first increased, then decreased, and gradually dissolved. The Sn-rich layer formed near the solder side and gradually increased in thickness, with microcracks occurring when the cross-sectional area of the joint increased to 0.75 mm2. The joint shear fracture path moved from the soldering zone near the cathode IMC layer to the interfacial IMC layer. The fracture mechanism of the joint changed from a mixed brittle/tough fracture, dominated by deconstruction and secondary cracking, to a brittle fracture dominated by deconstruction. The joint shear strength was reduced by 60.9% compared to that in the absence of electromigration.

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