2022
DOI: 10.3390/mi13040599
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Impact of Channels Aspect Ratio on the Heat Transfer in Finned Heat Sinks with Tip Clearance

Abstract: A 3D numerical study is used to analyze the flow topology and performance, in terms of heat transfer efficiency and required pumping power, of heat sink devices with different channel aspect-ratio in the presence of tip-clearance. Seven different channel aspect ratios AR, from 0.25 to 1.75, were analyzed. The flow Reynolds numbers Re, based on the average velocity evaluated in the device channels region, were in the range of 200 to 1000. Two different behaviors of the global Nusselt were obtained depending on … Show more

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Cited by 6 publications
(5 citation statements)
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“…Micromachines 2022, 13 Figure 9 shows the intergenerational optimization trajectories for finding the flow distribution through the genetic algorithm under four different chip working tions. Table 2 shows the comparison of the maximum operating temperature of t before and after the optimization of the flow distribution under the condition of a total flow.…”
Section: Results Analysesmentioning
confidence: 99%
See 1 more Smart Citation
“…Micromachines 2022, 13 Figure 9 shows the intergenerational optimization trajectories for finding the flow distribution through the genetic algorithm under four different chip working tions. Table 2 shows the comparison of the maximum operating temperature of t before and after the optimization of the flow distribution under the condition of a total flow.…”
Section: Results Analysesmentioning
confidence: 99%
“…Due to the broad application prospects of micro-channels, scholars have carried out extensive studies on the structure of micro-channels [10][11][12][13][14][15][16], heat transfer medium of micro-channels [17,18], heat transfer and flow properties of micro-channels [19][20][21], etc. In recent years, with the vigorous development of the new generation of artificial intelligence technology, machine learning and optimization algorithms have injected new vitality with intelligent characteristics into micro-channel research.…”
Section: Introductionmentioning
confidence: 99%
“…The results demonstrate that the chip designed with the GT-TTSV heat dissipation structure exhibits better heat dissipation effectiveness, higher current carrying capacity, and better reliability compared to chips utilizing back thinning technology in similar conditions. Compared to other heat dissipation structures [7][8][9][10][11][12][13][14][15][16][17][18][19][20], the structure proposed in this paper that embeds heat dissipation through silicon vias on the back of the chip, effectively reduces the size and weight of the system.…”
Section: Discussionmentioning
confidence: 99%
“…Therefore, a heat dissipation structure is needed to improve the reliability, power density, and integration of power chips. Many researches are carried out on the thermal management of electronic devices under high heat flux, using microchannel heat sink [7][8][9][10][11][12][13], metal foam heat sink [14,15], and optimizing chip layout [16] to improve the chip cooling capacity. Both microchannel heat sink and metal foam heat sink achieve chip cooling by adding additional heat dissipation structures, resulting in additional manufacturing costs and even incompatibility with semiconductor processes [17][18][19].…”
Section: Introductionmentioning
confidence: 99%
“…At the end of the 20th century, Tuckerman and Pease designed the electronic microchannel heat sink [ 3 ]. With the development of microchannel heat exchangers, the influence of microchannel geometry on performance is studied, including the channel cross-sectional shape [ 4 ], aspect ratio [ 5 , 6 , 7 ], channel distance [ 8 ], channel height [ 9 ], and channel width [ 10 ].…”
Section: Introductionmentioning
confidence: 99%