Research on Intelligent Distribution of Liquid Flow Rate in Embedded Channels for Cooling 3D Multi-Core Chips

Zhang, Jian; Xie, Zhihui; Lu, Zhuoqun; Li, Penglei; Xi, Kun

doi:10.3390/mi13060918

Cited by 7 publications

(4 citation statements)

References 32 publications

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“…The results demonstrate that the chip designed with the GT-TTSV heat dissipation structure exhibits better heat dissipation effectiveness, higher current carrying capacity, and better reliability compared to chips utilizing back thinning technology in similar conditions. Compared to other heat dissipation structures [7][8][9][10][11][12][13][14][15][16][17][18][19][20], the structure proposed in this paper that embeds heat dissipation through silicon vias on the back of the chip, effectively reduces the size and weight of the system.…”

Section: Discussionmentioning

confidence: 99%

“…Therefore, a heat dissipation structure is needed to improve the reliability, power density, and integration of power chips. Many researches are carried out on the thermal management of electronic devices under high heat flux, using microchannel heat sink [7][8][9][10][11][12][13], metal foam heat sink [14,15], and optimizing chip layout [16] to improve the chip cooling capacity. Both microchannel heat sink and metal foam heat sink achieve chip cooling by adding additional heat dissipation structures, resulting in additional manufacturing costs and even incompatibility with semiconductor processes [17][18][19].…”

Section: Introductionmentioning

confidence: 99%

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Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias

Hu,

Lu,

Bai

et al. 2024

IEICE Electron. Express

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In the research on heat dissipation technology of power chips, the back thinning method is adopted. However, the back thinning technology is facing the risk of causing damage to the chips because the mechanical support capacity of the chip is significantly reduced. To improve the heat dissipation capacity of the back side of the power chips while not affecting the mechanical support, the back side grid type thermal TSV (GT-TTSV) heat dissipation structure is proposed. Based on the proposed heat transfer structure, the heat dissipation structure is optimized and verified, and compared with the heat dissipation structure of back thinning technology. Simulation comparative study shows that the proposed structure has better heat dissipation ability and thermal reliability.

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias

Hu,

Lu,

Bai

et al. 2024

IEICE Electron. Express

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show abstract

“…Among them, the embedded heat sink cooling technology shortens the heat dissipation path of the chip from “chip-TIM-packing-shell-TIM-heat sink” to “chip-heat sink-working fluid”, that is, it bypasses the chip packaging and directly cools the hotspot of the chip [ 16 ], effectively coping with the more severe heat dissipation challenge caused by the surge during chip integration. Therefore, the research on embedded liquid cooling heat sinks has aroused extensive interest from many scholars, both at home and abroad [ 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 , 25 , 26 ].…”

Section: Introductionmentioning

confidence: 99%

Suitability of Embedded Liquid Cooling and Heat Generation for Chips

Zhang,

Wu,

Xie

et al. 2023

Micromachines

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Embedded liquid cooling is a preferred solution for dissipating the heat generated by high-power chips. The cooling capacity and pump power consumption of embedded liquid cooling heat sinks differ significantly between different structures. To achieve an accurate match between cooling capacity and heat dissipation requirements, the selection of a liquid-cooled heat sink should be carefully considered in conjunction with the heat dissipation needs of heat sources in real-world thermal management issues. Based on the manufacturing limitations on chip temperature and microchannel pressure, a composite performance index function was developed to assess the cooling capacity and cooling cost of the heat sink. This allowed for the establishment of an evaluation standard to determine the suitability of embedded liquid cooling and heat sink for the heat source. In this study, the suitability of four microchannel heat sinks with the same feature length and fin volume was evaluated under various thermal load conditions. The results show that the best-suited heat sink changes with variations in the thermal load of the chip. In the example, when the heat source was homogeneous at 100 W, the circular section pin fins have an optimal suitability of 0.928 for Re = 500. When the heat source was a heterogeneous heat source with a power of 100 W, the value of Θ was found to be 0.389. Additionally, the optimal suitability of drop section pin fins for Re = 971.5 was determined to be 0.862.

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“…Scholars worldwide have carried out a substantial amount of research on microchiplevel cooling technology [5][6][7][8][9][10][11][12][13]. Ansari et al [14] proposed a hybrid micro-heat sink for cooling microprocessors with non-uniform heat generation.…”

Section: Introductionmentioning

confidence: 99%

Thermal–Hydrodynamic Behavior and Design of a Microchannel Pin-Fin Hybrid Heat Sink

et al. 2022

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A three-dimensional convective heat transfer model of a microchannel pin-fin hybrid heat sink was established. Considering the non-uniform heat generation of 3D stacked chips, the splitting distance of pin-fins was optimized by minimizing the maximum heat sink temperature under different heat fluxes in the hotspot, the Reynolds numbers at the entrance of the microchannel, and the proportions of the pin-fin volume. The average pressure drop and the performance evaluation criteria were considered to be the performance indexes to analyze the influence of each parameter on the flow performance and comprehensive performance, respectively. The results showed that the maximum temperature of the hybrid heat sink attained a minimum value with an increase in the splitting distance. The average pressure drop in the center passage of the microchannel first increased and then decreased. Furthermore, the optimal value could not be simultaneously obtained with the maximum temperature. Therefore, it should be comprehensively considered in the optimization design. The heat flux in the hotspot was positively correlated with the maximum heat sink temperature. However, it had no effect on the flow pressure drop. When the Reynolds number and the pin-fin diameter increased, the maximum heat sink temperature decreased and the average pressure drop of the microchannel increased. The comprehensive performance of the hybrid heat sink was not good at small Reynolds numbers, but it significantly improved as the Reynolds number gradually increased. Choosing a bigger pin-fin diameter and the corresponding optimal value of the splitting distance in a given Reynolds number would further improve the comprehensive performance of a hybrid heat sink.

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Research on Intelligent Distribution of Liquid Flow Rate in Embedded Channels for Cooling 3D Multi-Core Chips

Cited by 7 publications

References 32 publications

Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias

Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias

Suitability of Embedded Liquid Cooling and Heat Generation for Chips

Thermal–Hydrodynamic Behavior and Design of a Microchannel Pin-Fin Hybrid Heat Sink

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