Impact of Broken High Frequency Signal Return Path on Signal Integrity

In this paper, a 3D model of an existing IC socket used for a QFP packaged chip with 48 pins on a 0.5mm pitch is built in Ansys's three-dimensional electromagnetic simulation software HFSS. Three different types of pin are simulated and their signal transmission characteristics are analyzed by comparing the simulated S-parameters. On the basis of this socket, a new socket physical model for QFP-48 is proposed with the change of pin's structure. The simulated S-parameters of the same pins show that the modified socket model has better signal transmission performance and can achieve higher operating frequency. Furthermore, the relationship between this new socket's relative permittivity and its signal transmission characteristics is analyzed.

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Impact of Broken High Frequency Signal Return Path on Signal Integrity

Cited by 3 publications

References 1 publication

Effects of partially broken HF signal return on different packaging levels

Effects of partially broken HF signal return on different packaging levels

Signal via coupling effects caused by partially broken high frequency signal return

Electrical performance analysis and structure optimization for QFP-48 sockets

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