m‐Xylylene bismaleimide: a versatile building block for high‐performance thermosets

Abstract

m-Xylylene bismaleimide, Compimide † MXBI (hereafter MXBI), was developed as a building block for formulating bismaleimide resins with improved processability. MXBI on its own, or in combination with 4,4′bismaleimidodiphenylmethane (Compimide MDAB, hereafter MDAB) and with 2,2′-diallylbisphenol-A as a comonomer, provides very low-melting resin blends, which can be processed at temperatures around 60-80°C via RTM (Resin Transfer Moulding), VARIM (Vacuum Assisted Resin Infusion Moulding), prepregging, and wet filament winding (FW). Uncured and cured resin properties were evaluated. The mechanical property spectrum of the MXBI/MDAB/diallylbisphenol-A system with varying MXBI/MDAB ratio shows almost equivalent contributions of MXBI and MDAB to the mechanical properties of a system. Higher MXBI proportions are responsible for lower resin viscosities and hence superior processability.

Fabrication and origin of new flame retarding bismaleimide resin system with low dielectric constant and loss based on microencapsulated hexaphenoxycyclotriphosphazene in low phosphorus content

“…Bismaleimides (BMI) resin is a representative of heat-resistant thermosetting resins [21,22], which has been widely used to fabricate products that can meet the harsh requirement on the integrated performances such as heat resistance, high mechanical properties and good dielectric properties, but its flame retardancy needs to be improved.…”

Synthesis and characterization of asymmetric bismaleimide oligomers with improved processability and thermal/mechanical properties

“…They are employed as base resins in advanced composites and printed circuit boards due to their high performance‐to‐cost ratio and relatively high temperature resistance. A consideration of both performance and cost has made BMI resins the leading contenders in the field of advanced thermosetting polymers .…”

“…They are employed as base resins in advanced composites and printed circuit boards due to their high performance-to-cost ratio and relatively high temperature resistance. A consideration of both performance and cost has made BMI resins the leading contenders in the field of advanced thermosetting polymers [1][2][3][4]. BMI oligomers are low-molecular-weight versions that are terminated by two maleimide functional groups, often containing multiple aromatic moieties in order to enhance their processability and cured properties.…”

Dual‐curing thermosetting monomer containing both propargyl ether and phthalonitrile groups

“…Thermal stability of FRP is limited by the polymer matrix while inorganic fibers (such as glass or carbon) possess much higher thermal stability. The development of such high‐temperature polymers as polyimides, bismaleimides, propargylated phenolic resins, and phthalonitriles expands the range of FRP applications in high temperature conditions. Phthalonitriles (PN) possess the highest thermal stability among the reported matrices but usually there is a disadvantage – bad processability caused by high melting points of phthalonitriles and long curing cycles.…”